Hello and welcome to you Ansys presentation

on best practices

in stimulating electronics reliability

Why do we care about electronics reliability

Because it's increasingly more difficult to

design electronics

All the major technology trends 5G autonomous

electrifitation industrial Internet of

things all demand more performance

smaller products and lower costs

The result we're seeing higher power in

today's electronics higher

speeds increasingly smaller packages

demands for performance at higher

temperatures

demands for performance under more strenuous

electromagnetic radiation

and the ability to do all this while still

maintaining

very high reliability over long periods of

time

We want to talk about simulation

Electronic reliability because we know and

we've demonstrated through multiple

case studies

that when we use simulation to evaluate

electronics reliability early in

the design process

we see enormous benefits Benefits in terms

of performance

Benefits in terms of reduction in design

cycles

Benefits in terms of reducing material costs

How do we do this how do we do simulation

electronics reliability the right way

The best way is through Ansys' broad range

of

simulation tools

That combined to provide an unrivaled

workflow

to give organizations and users worldwide the

ability to comprehensive

multi physics solution simulations

all the way down from the transistor level to

the

chip to the package to the PCB into full

and complete systems

And we do that by evaluating reliability from

an electrical

perspective thermal perspective mechanicles

perspective

We capture all those from a reliability

physics and we

allow all those reliability simulations

interact with each other to

provide a comprehensive multi physics

solution

And we do this in a variety of ways we

look at electrical reliability right there

are numerous number of

challenges when it comes to electrical

reliability

Whether it's improving power and signal

integrity with today's devices

minimizing EMI risk or improving antenna

performance

Ansys has the capabilities of solving those

challenges

through robust simulations system level ESD analysis

and direct current insulation resistance

based thermal analysis

The results dynamic checks on electrostatic

discharge sensitivity

connections with thermal mechanical

reliability solutions and possibly the most

important early detection mitigation of risk

due to EMI EMC

failures

Thermal reliability addresses its own

challenges whether optimizing cooling strategies

or addressing thermal management at multiple

scales from chip to

package to PCB

How does Ansys address those challenges from

a thermal reliability

perspective really with unrivaled

comprehensive electrothermal

and thermal structural multiphysics simulation

capabilities

The multiphysics capabilities offered through

Ansys' thermal reliability tools are

unrivaled

and which really exciting his ability to

provide that unrivaled

connection between electrical and thermal

and then present it in a reduced order

modeling

to extract the information and present it at

system level

Great examples of outputs from this thermal

reliability simulation include

obviously temperature prediction of

components or really enhance and optimized

cooling strategies

Only pay for the cooling strategy you

absolutely need how

do you do that you need accurate thermal

simulations

The thermal simulations need to tell you what

the effects

are from an electrical and mechanical

perspective and all three

need to connect in terms of reliability

prediction

Ansys obviously is the world leader when it

comes to

mechanical reliability simulations and

that's nowhere more true than

electronics really Ansys is the only tool

provider in

which its mechanical reliability tools focus

exclusively on electronic simulation

electronic designs and processes to provide

users an easy and

robust methodology for evaluating the mechanical

reliability of electronics

And this is more important than ever because

physical testing

is increasingly expensive is increasingly

time consuming time that most

design teams can't afford in terms of rushing

in terms

of addressing time to market needs

Like I said Ansys capabilities are unique

in that they

provide very direct and specific abilities to

model both the

PCB and the components

and provide extremely advanced solvers to

address some of these

really complex mechanical simulations

The result is an extremely streamline

workflow that provides very

accurate understandings of product

performance under a broad range of

thermal mechanical mechanical conditions such

as temperature cycling thermal shock

vibration and drop

What we like to do here at Ansys

to provide value to our customers is bringing all

these world

leading tools electrical reliability

simulation thermal reliability simulations

and mechanical reliability stations bring 'em

all together and provide

our users clear insight into what it all

means

And that is the linchpin of reliability

physics analysis

When we look or we perform electrical

reliability simulations or

thermal reliability simulations or mechanical

reliability simulations we have

to ask ourselves So what

What does it all mean

By taking it the final step and doing actual

predictions

through our unique reliability physics tools

we connect true costs

planning costs design costs to savings or costs

out in

the field warranty costs so now one can

design

your product to meet your reliable goals and

no more

no less

And then all these tools

in an amazing way talk to each other communicate

with each

other are tightly integrated with each other

this interaction of

multiple physics of which the core is Ansys

Icepak

really allows customers to optimize product

performance and provide deep

insights in their products in ways never seen

before and

far earlier in the design process

This comprehensive multiphysics allowed

customers to truly push

design based upon robust simulation

As opposed to stimulating whatever the design

team has come

up with

And by connecting all these different

simulation tools together it

increases collaboration across the enterprise

Like we said when you do simulation in the

right

way the benefits are measurable

and amazing

One customer Danfoss by using Ansys Sherlock

the leading reliability

physics tool for electronics they reduced

their time to market

by 75%

That's amazing

In addition another leading chip manufacturer

reduced their stimulation time

by over 2000 X

and naturally critical right to really get

deep understanding of

performance of your electronics

One need to do simulation at multiple steps

in the

product development process

and provide as much detail in the simulation

as possible

Many enterprises are often hesitant to do this

because

they're concerned about the time required to

do this

By ultilizing Ansys IcePak and Ansys

reduced order model capabilities

engineers exploited this capability to

provide full

CFD simulation far faster than before it

really makes simulation

the possibility of simulation to be deeply

embedded in the

product development process

And finally an antenna developer reduced

their material costs by

20%

by optimizing the design before building any

prototypes

You can read about all the key studies here

in

this presentation

So we provided a broad range of resources for

you

to learn more about electronics reliability

including white papers application

briefs customer stories

comprehensive webinars tips and tricks in our

own unique Ansys

learning hub

I especially would point you to the white

paper on

SAE J3168 which describing how the automotive

supply chain is

increasingly moving towards standardizing

simulation not just physical test

as a final step in validating any products

going in

in today's vehicle

As time to market its kind of market reduces

in the

automotive space but complexity rises

astronomically with the introduction

of autonomous electrification

the need for a simulation interchange between

supplier and customer

is increasingly necessary

So for the rest of presentation let's just do

a

brief overview of each of the capabilities

and break out

what they're able to bring in terms of

simulation best

practices

When we talk about electrical reliability

What really makes Ansys electrical reliability

tools stand out is

their ability to do an extensive range of

simulation capabilities

to capture all types of performance and

potential risk issues

and to do that at multiple levels within the

product

specifically around our chip package system

capability

further it's power integrity and reliability

simulation can start at

the transistor level work all the way through the

system

and the abilities

Within the Ansys tool set

to do these simulations in a way that you can

carry there from one level to the other and

you

can also couple these chip package system

interactions to ensure

full product functionality

Some examples include signal integrity

analysis

Which is increasingly critical as one goes to

higher speeds

especially for the latest memory technology

What we described as DCIR thermal simulation

I think

this is one of the cooler workflows within

the Ansys

product family here in a tightly coupled

interaction one can

compute DC voltage and DC current density in

Ansys SI wave send

that to Ansys IcePak Ansys IcePak then

send that

information back to Ansys SIwave to

update material

properties right now especially with the

copper which updates the

current density which then results in a new

computation this

thermal aware approach provides really the

industry leading most accurate

identification of current density and

temperature at the chip package

and even board level and more recently now

within the Ansys

family one can take that information and

compute electromigration failure

rates and lifetime

EMI simulation probably the most critical

aspect of any

kind of electronics reliability

within Anysys EMI simulation is just one

part of a

three legged stool including signal integrity

and power integrity to

make sure that your device and your PCB and

your

system works under a broad range of

electromagnetic radiation situations

These simulations under the auspices of

electric reliability provide clear

quantifiable benefits

like all simulations but especially

electric reliability simulations it reduces

the number of board spins it's going to

improve product

reliability especially through the unique

capability of thermal aware electromigration

simulation and it really guides designers in

the earliest stages

possible on how to improve EMI EMC and ESD

risk

mitigation are both device package and PCB

level

Under thermal reliability

Ansys provides what you need because

really there's really nothing

more important than thermal reliability when

it comes to electronics

almost every kind of performance or failure

mechanisms that drives

electronic reliability in some way shape or

form is influenced by

temperature

So the accuracy of knowing that temperature

in your electronics and controlling it

effectively is paramount

Ansys does this more effectively than any

other tool set

in the market because it can offer it at

every

single scale within the overall electronic

system from transistor and chip to package to

board and

assembly

to box level and finally the full system or

even

data center level and by using Ansys'

unique reduced order

models

physics based behavior can be carried from

one level to

the next in a way that's portable fast and

effective

Some examples of how thermal reliability is

done within the

Ansys tool set just some examples right

here one is

our unique ability to PCB thermal reliability

we provide very

high fidelity PC modeling capabilities unique

in the industry there's

a broad range of how one can capture thermal

conduction

and convection behavior at the PCB level are

unique orthotropic

connectivity map can capture trace via plane

and pad layer

pad data for each layer and very actually

capture these

thermal pathways to get very accurate

temperature predictions for every

single device on the PCB

Thermal reliability that is really the core or

the

crux of a lot of our reliability concerns

when it

comes to electronics and Ansys realizing that

makes Ansys IcePak

really the core of the foundation of our

multi

physics interaction within all our

electronics reliability tools

Whether it's at Ansys Maxwell or Ansys

SIwave Ansys

Redhawk or Ansys Sherlock IcePak talks to

all of them

in creating the robust workflows that ensures

that you've not

overlooked anything in regards to electronic

reliability for your electronic

system

And all these approaches in terms of thermal

reliability again

just like electrical reliability provide

clear quantifiable benefits

Thermal reliability starts with accurate

thermal models Ansys Icepak unlike

any other tool imports

a wide

array of formats for ECAD and

MCAD and push it out into very efficient

and effective

model creation

So you can decide the level of detail you

need

within your thermal model and control that in

ways unrivaled

by any other tool

You could do that analysis like I said at

every level of the electronic

ecosystem and the unique coupling between

Ansys Icepak and the

other Ansys tools especially Ansys Mechanical

and Ansys Sherlock allows engineers

to truly understand how to optimize that

thermal design

If you want thermal analysis you in a

standalone tool

all you know is temperature

Which is one thing but doesn't really tell

you what

it means in terms of reliability and at the

end of the day

that's why you're trying to determine

temperature otherwise just using

kind of old fashion and outdated thermal

derating tables that

provide little to no value to the

organization

By coupling with Ansys Mechanical and

Ansys Sherlock Ansys

Icepak really closes that loop

If that heat sink is cheaper than other heat

sink

You can compare the price savings on making

that switch

or the price increase to changes and

potential warranty returns

which is an analysis not available

among any other workflow

For mechanical reliability Ansys is openly

aware of the

deep simulation challenges mechanical

analysts have in simulating electronics

Most electronics nowadays especially for the

leading technology trends have

an amazingly large number of components with

very complex geometric

details

very complex PCBs with many features and

numerous materials including

metals ceramics and polymers

Ansys provides truly best in class solutions

by taking information

from the CAD integrating it with embedded

libraries and automated

workflows to provide you the user amazingly

quick and accurate

models of those ECADs that are ready from

stage

one that are simulation ready

Even for the most complex physical

simulations

How do we do this just some examples best in

class PCB modeling using Ansys Sherlocki and

Ansys Mechanical you have

a broad range

in terms of how you wish to address your PCB

in your simulation model whether you want to

use lumped

models that capture material properties over

the entire board

trace mapping which uses an overlay mesh

new reinforcement capability which allows you

to model the all

the traces and vias within a PCB or even

trace

modeling which models all the traces and vias

in

a 3D structure especially for relatively

small areas

Each of these provide improvements

or tradeoffs

in terms of speed and accuracy but only under

Ansys

you have all those capabilities within one

tool set

Once you have the geometry material properly

setup which occurs

almost seamlessly within Ansys you have a

broad range of

simulations one could do to evaluate a range

of possible

risks in terms electronics reliability

whether it's hot or reflow

and warpage moisture effects shock and

vibration or even drop

and tumbling all these static and dynamic

behaviors can be

captured accurately within the Ansys

Mechanical reliability family

And just like thermo electrical these feature

deliver clear quantifiable

benefits

How would you like to know way up front in

the design if there's any risk in terms of

any

environment your product might see from a

mechanical perspective and

avoid that issue way up front even at

component selection

Right and then how would you like to reduce

the

amount of physical testing you're currently

required to do not

just for initial launch but also to deal with

future

changes in the automotive industry changes

are done on annual

basis

And the cost to revalidate those changes can

be north

of $100,000

Think about the cost and time savings if you

could

replace that

with mechanical reliability

simulation

We take all those as we talked about and we

bring them into reliability physics and

mechanical reliability the thermal

reliability and electric reliability why because

we're trying to break

the old workflow right or the old design

build test

fix

This process doesn't work Right and with the

simulation capabilities

we have today really should never be done in

the

first place one should simulate then design and

then build

and then sell and then make money

Can we do this to our

reliability for with this capabilities the

linchpin of the reliability for

this workflow within Ansys is Ansys Sherlock

it's a tool

we use is specifically for electronics to help

user really mitigate

almost any kind of failure mechanism that

could occur from

electrical thermal or mechanical loads and

works in tight integration

with a number of other ansys products

especially Ansys IcePak

and Ansys Mechanical

By using Ansys Sherlock in combination with

these other Ansys

tools early in the design process

opens up

huge opportunity in terms of improving the

overall electronic design

workflow especially using it as early as

initial part selection

pick the right parts at the right time

Just like the other tools it provides clear

quantifiable benefits

especially the manufacture ability

capabilities can improve first class

yields and reduce manufacturing defects but

most importantly it really

ties the value of simulation back to the bill

of

material cost

knowing those tradeoffs and optimize the

design before you

ever go to first test

And all this works because of an unrivaled

workflow as

you can see here starting with Sherlock to

utilize its

best in class preprocessing to feed into

Icepak and

Ansys mechanical all four of these tools work

closely together

to provide you unrivalled insight in terms of

the electrical

thermal mechanical and physics based

reliability of your electronic device

package board and system

I said no better example then the

electro thermal

analysis tight integration between SIwave and

Icepak and

HFSs and Icepak the ability to kind of

run those electrical simulations capture those

electrical loads feed them

for thermal simulations and feed that back to

account for

temperature dependency in material properties

is unrivaled anywhere else

It ensures a high level of accuracy for both the

electromagnetic and

thermal simulations

And finally all these tools work together to

optimize the

performance of electronic systems