主题介绍
5G时代的电子产品集成度,电源密度等越来越高,带来一系列的电、热、结构的可靠性问题。本视频讲从新时代电子产品电、热、结构的挑战出发,介绍Ansys相对应的解决方案以及复杂多物理场耦合可靠性案例。
如有任何问题请点击以下链接进入答疑室与我们的技术专家进行交流互动
高速电路答疑室:https://v.ansys.com.cn/live/e3f54d2a
https://v.ansys.com.cn/live/50573855
演讲人简介
Craig Hillman
该演讲为Ansys Simulation World 虚拟大会视频
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大家好 欢迎观看Ansys
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电子可靠性仿真
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最佳实践演示
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我们为什么要关注电子产品的可靠性
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因为
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电子产品的设计难度日益攀升
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主流技术趋势如5G与自动驾驶
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电气化和工业物联网
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这都需要实现更高的性能
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更小巧的产品外形和更低的成本
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这造成了
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电子产品的
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运行速度更快 包装越来越轻巧
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高温性能要求更高
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需要
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在较强
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电磁辐射下发挥卓越性能
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除此之外
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还要
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长期保持高度
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可靠性
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我们今天之所以探讨
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电子可靠性仿真
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因为我们深知并已有多个案例研究
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显示
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如果在设计进程的早期
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就使用仿真来评估
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电子可靠性
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就有助于发挥巨大优势
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包括性能
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以及缩短设计
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周期
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以及降低物料成本的优势
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那么我们如何实现这些优势
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如何正确仿真电子产品的可靠性
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最好的方法是运用Ansys
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提供的
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广泛丰富的仿真工具
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将工具结合形成无可比拟的
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工作流程
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支持全球的机构和用户
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进行全面的
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多物理场仿真
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从底层的晶体管级
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直到
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芯片级与封装和PCB
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乃至整个系统
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我们采用电气仿真
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热仿真
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和机械仿真评估可靠性
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采集
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可靠性数据
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并且
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支持所有这些可靠性仿真
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相互作用
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提供全面的多物理场
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解决方案
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具体方法多种多样
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以电气可靠性来说
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电气可靠性方面
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面临许多
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挑战
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无论是提高
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当前设备的功率和信号完整性
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还是管控EMI风险或提高天线
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性能
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Ansys能够解决此类可靠性难题
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借助鲁棒性仿真
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系统级ESD分析
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以及基于直流绝缘电阻的热分析
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我们能够
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动态检查
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静电放电灵敏度
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连接热机械可靠性解决方案
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而最重要的目的或许在于
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尽早发现并应对
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由EMI/EMC故障带来的
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风险
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无论是优化散热策略
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还是解决从芯片到封装
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再到PCB的
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多尺度热管理
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热可靠性方面需要应对自身特有挑战
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那么Ansys如何应对热可靠性方面的
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这些挑战
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凭借无可比拟的电热
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和热结构多物理场仿真
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Ansys热可靠性工具
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提供的
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独特多物理场功能
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尤其强大的是
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能够实现
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电气分析与
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热分析之间的
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紧密连接
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然后以降阶
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建模的方式呈现
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将提取的信息
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在系统级层面呈现
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热可靠性
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仿真的输出示例包括
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组件的温度预测
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或增强和优化
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散热策略
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有了这些助力
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您只需要投资
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对您最有价值的散热策略即可
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要实现这一点
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您需要开展精确的热仿真
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热仿真应着眼电气和机械的角度
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展示
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相关的效果
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这三者需要在可靠性预测方面
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互相关联
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机械可靠性仿真方面
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Ansys
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毋庸置疑具有世界领先水平
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这一点
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在电子产品仿真中尤其明显
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业内只有Ansys提供的
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机械可靠性工具
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专注于电子仿真
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电子设计和流程
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为用户提供了一种简单而
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稳健的方法来评估
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电子产品的机械可靠性
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当今局势下这一点尤为关键
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因为物理测试
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成本日渐高昂
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也越来越耗时
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如今大多数设计团队
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都越来越难以满足
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投放市场周期的时限
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正如我所说的
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Ansys的能力是独一无二的
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因为它们为
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PCB和组件
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提供了非常直观和具体的建模能力
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并提供了极其先进的求解器
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能够处理
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极为复杂的机械仿真
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用户能够得到极为简化的
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工作流程
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形成了在
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各种
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热机械条件下
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如温度循环 热冲击 振动和跌落
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对产品性能非常准确的机械分析
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我们在Ansys
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力求为客户提供价值
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带来世界领先的工具
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开展电气可靠性仿真
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热可靠性仿真
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和机械可靠性仿真
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结合所有这些
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帮助我们的用户深入了解
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各种现象的机制
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这是可靠性
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物理分析的关键
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当我们观察或实施电气
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可靠性仿真或
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热可靠性仿真或
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机械可靠性仿真时
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我们首先要问自己
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那么这一切的意义何在
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通过我们独到的
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可靠性物理分析工具
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提供最终的真实预测
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我们将真实的成本
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规划和设计成本
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与现场成本
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如质保成本等方面的节约紧密相连
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那么
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用户就能设计出
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符合可靠性目标的产品
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既不会成本超支也不会性能不足
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并且所有这些工具
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能够通过非常神奇的方式
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相互交流
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彼此紧密结合
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这种以Ansys Icepak为核心的
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多物理场
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互动
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能够支持客户优化产品性能
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并以
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前所未有的方式
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带来对产品的
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深刻见解
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这种全面的多物理场技术
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使客户能够
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基于设计的鲁棒性仿真推进设计
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而不是去仿真任何
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设计团队凭自身喜好
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构思的概念
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通过将所有这些不同的
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仿真工具连接在一起
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可以增强整个企业内的协作
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就像我们所说的
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如果您以正确的方式进行仿真
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好处便是可观和
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惊人的
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使用领先的可靠性物理场工具
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Ansys Sherlock
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我们的客户Danfoss将
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产品投放市场周期
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缩短了75%
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这很神奇
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而另一个业界领先的芯片制造商
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将仿真时间缩短了
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2000多倍
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能够
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深入了解
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您的电子产品的性能显得尤为正确
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人们需要
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在
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产品开发过程的多个步骤中进行仿真
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并在仿真中提供
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尽可能多的细节
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许多企业经常在这方面犹豫不决
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因为
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他们担心这样做
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会花费太多时间
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通过Ansys Icepak和Ansys
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降阶模型功能
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工程师利用这种能力
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可以提供比以往
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更迅速的完整CFD仿真
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这有助于仿真
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切实地
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深入到
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产品开发过程的多个步骤中
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最后 一个天线开发商
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在构建原型之前
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通过优化设计
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便实现了物料成本20%的
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节约
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在本次演示中提供的
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所有案例研究
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00:09:37.63 - 00:09:38.60 11
都有详细资料可供您参阅
-
00:09:44.20 - 00:09:47.34 9
我们提供了大量资源
-
00:09:47.34 - 00:09:47.62 2
助您
-
00:09:47.69 - 00:09:50.83 16
了解更多关于电子产品可靠性的信息
-
00:09:50.83 - 00:09:53.14 5
包括白皮书
-
00:09:53.21 - 00:09:54.82 9
应用简介和客户案例
-
00:09:54.82 - 00:09:58.33 14
我们独特的Ansys学习中心
-
00:09:58.33 - 00:09:59.89 8
提供了网络研讨会
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00:09:59.97 - 00:10:00.91 7
以及提示和技巧
-
00:10:00.91 - 00:10:04.38 8
我要特别指出的是
-
00:10:04.38 - 00:10:04.76 2
关于
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00:10:04.84 - 00:10:08.31 19
SAE J3168白皮书 其描述了汽车
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00:10:08.31 - 00:10:09.54 3
供应链
-
00:10:09.62 - 00:10:13.09 13
日益趋向于标准化仿真的过程
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00:10:13.09 - 00:10:15.41 11
而不仅仅是依赖物理测试
-
00:10:15.41 - 00:10:18.82 5
将仿真作为
-
00:10:18.82 - 00:10:19.35 6
当今汽车产品
-
00:10:19.42 - 00:10:20.79 10
上市前的最后一步验证
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00:10:20.79 - 00:10:24.26 13
随着电气化与自动驾驶等技术
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00:10:24.26 - 00:10:24.50 1
在
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00:10:24.57 - 00:10:28.05 7
汽车行业的推广
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00:10:28.05 - 00:10:30.14 8
汽车市场的复杂性
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00:10:30.21 - 00:10:32.46 5
也急剧上升
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00:10:32.46 - 00:10:36.27 8
因此越来越有必要
-
00:10:36.27 - 00:10:38.14 9
在供应商和客户之间
-
00:10:38.22 - 00:10:40.35 6
进行仿真交流
-
00:10:45.51 - 00:10:48.01 12
那么在本次演示的剩余部分
-
00:10:48.01 - 00:10:48.13 2
今天
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00:10:48.18 - 00:10:50.69 15
我们将对各项功能做一个简要概述
-
00:10:50.69 - 00:10:51.30 3
并讨论
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00:10:51.36 - 00:10:53.87 3
它们在
-
00:10:53.87 - 00:10:54.37 4
仿真最佳
-
00:10:54.37 - 00:10:54.87 7
实践方面的功能
-
00:10:58.84 - 00:11:00.82 7
电气可靠性方面
-
00:11:04.04 - 00:11:06.97 13
真正让Ansys电气可靠性
-
00:11:06.97 - 00:11:08.07 7
工具脱颖而出的
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00:11:08.14 - 00:11:11.07 13
是它们能够进行各种丰富类型
-
00:11:11.07 - 00:11:12.37 5
仿真的能力
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00:11:12.43 - 00:11:15.36 11
能够锁定各类性能问题和
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00:11:15.36 - 00:11:16.41 6
潜在风险问题
-
00:11:16.41 - 00:11:19.66 2
并在
-
00:11:19.66 - 00:11:20.17 14
产品内的多个层级上实现这一点
-
00:11:20.24 - 00:11:23.50 12
特别是我们的芯片封装系统
-
00:11:23.50 - 00:11:24.16 4
分析能力
-
00:11:24.16 - 00:11:26.64 11
此外电源完整性和可靠性
-
00:11:26.64 - 00:11:27.85 2
仿真
-
00:11:27.91 - 00:11:30.39 9
能够从晶体管级开始
-
00:11:30.39 - 00:11:30.72 4
贯穿系统
-
00:11:30.78 - 00:11:31.83 3
和功能
-
00:11:31.83 - 00:11:34.46 10
在Ansys工具集内
-
00:11:34.46 - 00:11:37.08 6
进行这类仿真
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00:11:37.14 - 00:11:39.76 9
您可以通过集成互联
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00:11:39.76 - 00:11:39.88 9
跨越多层面协作统筹
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00:11:39.94 - 00:11:42.56 15
耦合这些芯片封装系统的相互作用
-
00:11:42.56 - 00:11:43.67 3
以确保
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00:11:43.67 - 00:11:45.18 7
完整的产品功能
-
00:11:48.59 - 00:11:51.84 13
这方面的示例包括信号完整性
-
00:11:51.84 - 00:11:51.99 2
而且
-
00:11:51.99 - 00:11:54.57 9
随着传输速度的提升
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00:11:54.57 - 00:11:55.37 9
这一点也越来越重要
-
00:11:55.43 - 00:11:57.90 14
在新型存储技术面世后尤其如此
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00:12:03.01 - 00:12:05.85 16
这是我们称为DCIR热仿真的工具
-
00:12:05.85 - 00:12:06.36 3
我认为
-
00:12:06.42 - 00:12:09.26 2
这是
-
00:12:09.26 - 00:12:09.71 5
Ansys
-
00:12:09.77 - 00:12:12.61 14
产品系列中较酷的一种工作流程
-
00:12:12.61 - 00:12:13.56 11
在这种紧密耦合的交互中
-
00:12:13.56 - 00:12:16.40 6
您可以计算出
-
00:12:16.40 - 00:12:17.04 26
Ansys SI Wave中的直流电压和直流电流密度
-
00:12:17.10 - 00:12:19.94 17
将其发送到Ansys Icepak
-
00:12:19.94 - 00:12:20.51 18
Ansys Icepak然后将该信息
-
00:12:20.58 - 00:12:23.42 16
发送回Ansys SI Wave
-
00:12:23.42 - 00:12:24.11 5
以立即更新
-
00:12:24.11 - 00:12:26.99 4
材料特性
-
00:12:26.99 - 00:12:28.27 4
尤其是铜
-
00:12:28.33 - 00:12:31.21 8
而后更新电流密度
-
00:12:31.21 - 00:12:32.16 10
进而启动新的计算任务
-
00:12:32.23 - 00:12:35.10 7
这种热感知方法
-
00:12:35.10 - 00:12:36.89 5
在芯片封装
-
00:12:36.89 - 00:12:39.92 6
甚至电路板级
-
00:12:39.92 - 00:12:41.54 8
提供了业界领先的
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00:12:41.61 - 00:12:44.64 13
对电流密度和温度的精确识别
-
00:12:44.64 - 00:12:45.18 13
最近在Ansys产品系列中
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00:12:45.24 - 00:12:48.27 12
用户已经可以利用此类信息
-
00:12:48.27 - 00:12:50.16 5
计算电迁移
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00:12:50.16 - 00:12:51.37 6
故障率和寿命
-
00:12:55.53 - 00:12:58.51 18
EMI仿真可能是大部分电子可靠性分析
-
00:12:58.51 - 00:12:59.44 6
最关键的部分
-
00:12:59.51 - 00:13:01.57 10
但在Ansys工具中
-
00:13:01.57 - 00:13:04.40 7
EMI仿真只是
-
00:13:04.40 - 00:13:04.78 6
三大支柱之一
-
00:13:04.84 - 00:13:07.68 10
其他还包括信号完整性
-
00:13:07.68 - 00:13:09.13 6
和电源完整性
-
00:13:09.20 - 00:13:12.03 11
以确保您的设备和PCB
-
00:13:12.03 - 00:13:12.22 4
以及您的
-
00:13:12.22 - 00:13:15.04 5
系统能够在
-
00:13:15.04 - 00:13:16.74 11
各类电磁辐射情况下工作
-
00:13:22.01 - 00:13:25.15 6
受电气可靠性
-
00:13:25.15 - 00:13:27.17 10
支持的这类仿真提供了
-
00:13:27.24 - 00:13:28.71 14
与所有Ansys仿真同水平的
-
00:13:28.71 - 00:13:31.18 8
明确的可量化优势
-
00:13:31.18 - 00:13:32.99 10
尤其是电气可靠性仿真
-
00:13:33.04 - 00:13:35.51 15
它能够减少电路板设计返工的次数
-
00:13:35.51 - 00:13:36.06 9
将提高产品的可靠性
-
00:13:36.12 - 00:13:38.59 5
特别是通过
-
00:13:38.59 - 00:13:40.84 13
热感知电迁移仿真的独特能力
-
00:13:40.84 - 00:13:44.43 2
它在
-
00:13:44.43 - 00:13:45.95 9
设备封装和PCB级
-
00:13:46.03 - 00:13:49.62 14
在提高EMI EMC和ESD
-
00:13:49.62 - 00:13:49.78 9
风险抗性的初级阶段
-
00:13:49.86 - 00:13:53.45 8
为设计人员提供了
-
00:13:53.45 - 00:13:53.69 5
正确的指导
-
00:13:59.18 - 00:14:00.80 6
热可靠性方面
-
00:14:03.09 - 00:14:05.70 17
Ansys提供了您所需要的一切工具
-
00:14:05.70 - 00:14:07.09 2
因为
-
00:14:07.15 - 00:14:09.76 6
在电子产品中
-
00:14:09.76 - 00:14:11.10 6
没有什么特性
-
00:14:11.16 - 00:14:13.77 8
比热可靠性更重要
-
00:14:13.77 - 00:14:14.99 5
几乎每一种
-
00:14:14.99 - 00:14:18.10 13
电子可靠性的性能或故障机制
-
00:14:18.10 - 00:14:19.34 8
都会在某种程度上
-
00:14:19.41 - 00:14:20.17 5
受温度影响
-
00:14:20.17 - 00:14:23.11 2
因此
-
00:14:23.11 - 00:14:25.70 11
准确了解电子产品的温度
-
00:14:25.70 - 00:14:26.74 13
并进行有效管控是至关重要的
-
00:14:30.19 - 00:14:33.05 18
这方面Ansys比市场上的其它工具都
-
00:14:33.05 - 00:14:33.75 4
更加有效
-
00:14:33.82 - 00:14:36.68 5
因为它能够
-
00:14:36.68 - 00:14:36.75 2
涵盖
-
00:14:36.81 - 00:14:39.49 8
整个电子系统中的
-
00:14:39.49 - 00:14:44.21 4
所有尺度
-
00:14:44.21 - 00:14:45.26 10
从晶体管和芯片到封装
-
00:14:45.37 - 00:14:46.21 8
再到电路板和总成
-
00:14:46.21 - 00:14:49.70 11
再到机箱级以及整个系统
-
00:14:49.70 - 00:14:50.01 7
甚至数据中心级
-
00:14:50.09 - 00:14:53.58 10
使用Ansys独特的
-
00:14:53.58 - 00:14:54.82 2
降阶
-
00:14:54.90 - 00:14:55.37 2
模型
-
00:14:55.37 - 00:14:59.49 10
基于物理场的行为可以
-
00:14:59.49 - 00:15:00.41 11
通过一种迅捷有效的方式
-
00:15:00.50 - 00:15:04.62 3
从一级
-
00:15:04.62 - 00:15:05.27 6
转移到下一级
-
00:15:08.51 - 00:15:11.76 12
有关在Ansys工具集内
-
00:15:11.76 - 00:15:12.78 9
实现热可靠性的方法
-
00:15:12.85 - 00:15:16.11 6
这举几个例子
-
00:15:16.11 - 00:15:16.76 3
一个是
-
00:15:16.84 - 00:15:20.09 12
我们独特的PCB热可靠性
-
00:15:20.09 - 00:15:21.25 4
我们提供
-
00:15:21.25 - 00:15:24.51 5
业界少有的
-
00:15:24.51 - 00:15:26.25 10
超高保真PC建模能力
-
00:15:26.32 - 00:15:29.58 5
帮助用户在
-
00:15:29.58 - 00:15:30.30 9
PCB级捕捉热传导
-
00:15:30.38 - 00:15:33.64 5
我们独有的
-
00:15:33.64 - 00:15:34.94 9
正交各向异性连接图
-
00:15:34.94 - 00:15:37.96 4
可以捕捉
-
00:15:37.96 - 00:15:38.84 7
每层的平面线迹
-
00:15:38.90 - 00:15:41.93 3
和每层
-
00:15:41.93 - 00:15:42.60 4
焊盘数据
-
00:15:42.67 - 00:15:45.69 14
并且非常精确地捕捉这些热路径
-
00:15:45.69 - 00:15:47.44 8
从而对PCB上的
-
00:15:47.44 - 00:15:49.00 15
每个器件进行极为精确的温度预测
-
00:15:54.42 - 00:15:56.99 7
热可靠性实际上
-
00:15:56.99 - 00:15:57.22 2
就是
-
00:15:57.28 - 00:15:59.86 15
我们许多可靠性问题的核心或症结
-
00:15:59.86 - 00:16:00.09 2
所在
-
00:16:00.14 - 00:16:02.72 12
Ansys对这方面的关注
-
00:16:02.72 - 00:16:03.75 15
让Ansys Icepak真正
-
00:16:03.75 - 00:16:06.57 4
成为我们
-
00:16:06.57 - 00:16:06.95 8
电子可靠性工具中
-
00:16:07.01 - 00:16:09.83 7
多物理场交互的
-
00:16:09.83 - 00:16:11.02 4
基础核心
-
00:16:11.02 - 00:16:13.71 24
无论是在Ansys Maxwell还是Ansys
-
00:16:13.71 - 00:16:14.31 7
SI Wave
-
00:16:14.37 - 00:16:17.06 29
Ansys Redhawk还是Ansys Sherlock
-
00:16:17.06 - 00:16:17.60 15
Icepak都能与它们进行交互
-
00:16:17.66 - 00:16:20.35 9
创建稳健的工作流程
-
00:16:20.35 - 00:16:21.31 7
该流程为您呈现
-
00:16:21.31 - 00:16:23.99 9
电子系统的完整内容
-
00:16:23.99 - 00:16:25.83 8
在电子可靠性方面
-
00:16:25.89 - 00:16:26.25 8
覆盖您的整个系统
-
00:16:31.58 - 00:16:34.32 11
热可靠性的这些分析方法
-
00:16:34.32 - 00:16:35.36 2
其实
-
00:16:35.42 - 00:16:38.16 8
与电气可靠性一样
-
00:16:38.16 - 00:16:39.57 10
具有明确的可量化优势
-
00:16:39.57 - 00:16:42.74 4
热可靠性
-
00:16:42.74 - 00:16:44.92 8
基于精确的热模型
-
00:16:44.99 - 00:16:48.16 17
与众不同的Ansys Icepak
-
00:16:48.16 - 00:16:48.59 9
可导入广泛且丰富的
-
00:16:48.66 - 00:16:51.48 13
各类ECAD和MCAD格式
-
00:16:51.48 - 00:16:55.63 8
利用这些数据进行
-
00:16:55.63 - 00:16:56.65 5
非常有效的
-
00:16:56.74 - 00:16:58.04 2
建模
-
00:16:58.04 - 00:17:01.38 5
帮助您选择
-
00:17:01.38 - 00:17:01.45 1
在
-
00:17:01.53 - 00:17:04.87 11
热模型中所需的细节等级
-
00:17:04.87 - 00:17:05.99 14
并通过其它工具无法提供的方式
-
00:17:06.06 - 00:17:07.33 4
进行控制
-
00:17:07.33 - 00:17:10.14 5
我前面讲过
-
00:17:10.21 - 00:17:12.07 5
可以在电子
-
00:17:12.07 - 00:17:15.12 13
生态系统的各个层级进行分析
-
00:17:15.12 - 00:17:16.34 22
Ansys Icepak和其他Ansys工具
-
00:17:16.41 - 00:17:19.46 21
尤其是与Ansys Mechanical和
-
00:17:19.46 - 00:17:21.84 19
Ansys Sherlock的独特耦合
-
00:17:21.90 - 00:17:24.96 4
使工程师
-
00:17:24.96 - 00:17:25.64 14
能够真正了解优化热设计的方法
-
00:17:25.64 - 00:17:29.16 5
如果您想在
-
00:17:29.16 - 00:17:29.79 13
一个独立的工具中进行热分析
-
00:17:29.79 - 00:17:31.42 10
那就只能得到温度数据
-
00:17:34.24 - 00:17:36.73 9
这虽然是有效的数据
-
00:17:36.73 - 00:17:37.06 11
但对可靠性分析意义有限
-
00:17:37.12 - 00:17:39.61 13
毕竟可靠性分析才是最终目的
-
00:17:39.61 - 00:17:39.89 2
否则
-
00:17:39.94 - 00:17:42.43 6
就和过去使用
-
00:17:42.43 - 00:17:43.82 3
老式的
-
00:17:43.82 - 00:17:47.00 9
热衰减表没什么区别
-
00:17:47.00 - 00:17:48.13 5
对有关机构
-
00:17:48.20 - 00:17:51.38 5
几乎不具备
-
00:17:51.38 - 00:17:51.46 4
任何价值
-
00:17:51.46 - 00:17:54.45 20
通过与Ansys Mechanical和
-
00:17:54.45 - 00:17:55.78 17
Ansys Sherlock的耦合
-
00:17:55.84 - 00:17:57.71 23
Ansys Icepak在真正意义上形成了闭环
-
00:17:57.71 - 00:18:01.14 8
如果某款散热器比
-
00:18:01.14 - 00:18:01.45 7
其他散热器便宜
-
00:18:01.45 - 00:18:05.22 8
您可以将价格节省
-
00:18:05.22 - 00:18:06.05 5
或价格增加
-
00:18:06.14 - 00:18:09.91 4
与更换和
-
00:18:09.91 - 00:18:11.42 10
保修退货成本进行比较
-
00:18:11.42 - 00:18:13.72 10
这是任何其他工作流程
-
00:18:13.72 - 00:18:15.05 10
都无法提供的分析功能
-
00:18:20.09 - 00:18:23.59 13
在机械可靠性方面Ansys
-
00:18:23.59 - 00:18:24.45 4
已意识到
-
00:18:24.53 - 00:18:28.04 5
机械分析师
-
00:18:28.04 - 00:18:30.85 17
在仿真电子产品时所面临的深层次挑战
-
00:18:30.85 - 00:18:33.54 9
当今大多数电子产品
-
00:18:33.54 - 00:18:35.34 14
尤其是引领技术潮流的电子产品
-
00:18:35.40 - 00:18:38.10 10
都拥有数量惊人的部件
-
00:18:38.10 - 00:18:39.42 5
其几何细节
-
00:18:39.48 - 00:18:39.90 4
非常复杂
-
00:18:39.90 - 00:18:44.00 8
采用复杂的PCB
-
00:18:44.00 - 00:18:46.28 12
具有多种特性和繁多的材料
-
00:18:46.37 - 00:18:48.93 12
包括金属和陶瓷以及聚合物
-
00:18:48.93 - 00:18:51.98 11
通过从CAD中获取信息
-
00:18:51.98 - 00:18:53.40 12
Ansys将其与嵌入式库
-
00:18:53.47 - 00:18:56.52 10
和自动化工作流程集成
-
00:18:56.52 - 00:18:57.88 9
提供一流的解决方案
-
00:18:57.94 - 00:19:01.00 5
为用户提供
-
00:19:01.00 - 00:19:02.15 5
从第一阶段
-
00:19:02.15 - 00:19:05.84 7
就能够用于仿真
-
00:19:05.84 - 00:19:06.25 8
且基于ECAD的
-
00:19:06.33 - 00:19:08.72 8
快速而准确的模型
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00:19:08.72 - 00:19:11.75 14
即使是最复杂的物理仿真也可以
-
00:19:11.75 - 00:19:12.56 13
轻松应对您需要的精确热仿真
-
00:19:15.99 - 00:19:19.41 18
我们通过一流的PCB建模来实现这一点
-
00:19:19.49 - 00:19:22.99 7
这里举几个例子
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00:19:22.99 - 00:19:25.02 17
使用Ansys Sherlocki
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00:19:25.09 - 00:19:26.11 17
和Ansys Mechanical
-
00:19:26.11 - 00:19:29.15 12
在仿真模型处理PCB方面
-
00:19:29.22 - 00:19:32.33 6
您有多种选择
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00:19:32.33 - 00:19:33.02 8
无论您是希望使用
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00:19:33.09 - 00:19:36.20 9
集总模型来捕捉整个
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00:19:36.20 - 00:19:37.31 3
电路板
-
00:19:37.31 - 00:19:41.77 11
使用覆盖网格的迹线映射
-
00:19:41.77 - 00:19:44.78 6
新的加固功能
-
00:19:44.78 - 00:19:45.92 7
来仿真PCB内
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00:19:45.99 - 00:19:49.00 8
的所有走线和过孔
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00:19:49.00 - 00:19:49.07 3
甚至对
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00:19:49.13 - 00:19:52.15 10
3D结构中的所有迹线
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00:19:52.15 - 00:19:52.28 3
与过孔
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00:19:52.28 - 00:19:55.97 4
进行建模
-
00:19:55.97 - 00:19:56.55 12
尤其适用于较小区域的建模
-
00:19:56.55 - 00:19:59.21 4
这些都在
-
00:19:59.21 - 00:20:00.10 14
速度和精度方面实现改进或优化
-
00:20:00.16 - 00:20:02.82 8
这一切的目的在于
-
00:20:02.82 - 00:20:03.18 7
通过Ansys
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00:20:03.24 - 00:20:05.90 2
实现
-
00:20:05.90 - 00:20:06.26 11
单个工具集覆盖所有能力
-
00:20:11.92 - 00:20:14.99 4
一旦您在
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00:20:14.99 - 00:20:16.09 23
Ansys中对几何结构材料进行了几乎无缝的设置
-
00:20:16.16 - 00:20:19.23 6
您就可以开展
-
00:20:19.23 - 00:20:19.99 5
各类的仿真
-
00:20:20.06 - 00:20:23.13 3
来评估
-
00:20:23.13 - 00:20:23.89 8
电子可靠性方面的
-
00:20:23.89 - 00:20:26.96 7
一系列潜在风险
-
00:20:26.96 - 00:20:28.33 13
无论是高温还是回流焊或翘曲
-
00:20:28.40 - 00:20:31.48 5
湿效应冲击
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00:20:31.48 - 00:20:32.57 10
和振动甚至跌落和翻滚
-
00:20:32.64 - 00:20:35.72 9
所有这些静态和动态
-
00:20:35.72 - 00:20:36.95 5
行为都可以
-
00:20:36.95 - 00:20:40.01 17
在Ansys Mechanical
-
00:20:40.01 - 00:20:41.44 10
可靠性系列中准确捕捉
-
00:20:45.65 - 00:20:48.92 7
与热电分析相似
-
00:20:48.92 - 00:20:50.89 14
这些仿真同样具有明确的可量化
-
00:20:50.96 - 00:20:51.55 2
优势
-
00:20:51.55 - 00:20:54.03 10
如果从机械的角度来看
-
00:20:54.09 - 00:20:56.74 14
您的产品在任何环境下都有风险
-
00:20:56.74 - 00:20:56.80 2
那么
-
00:20:56.86 - 00:20:59.52 12
怎样才能提前掌握设计效果
-
00:20:59.52 - 00:21:00.88 7
甚至选择组件时
-
00:21:00.88 - 00:21:04.37 5
就能够避免
-
00:21:04.37 - 00:21:05.30 5
这类问题呢
-
00:21:05.30 - 00:21:08.19 6
而且您应如何
-
00:21:08.19 - 00:21:08.32 1
去
-
00:21:08.39 - 00:21:11.28 9
减少物理测试的数量
-
00:21:11.28 - 00:21:12.38 5
不仅是为了
-
00:21:12.44 - 00:21:15.34 4
产品上市
-
00:21:15.34 - 00:21:15.79 2
也要
-
00:21:15.79 - 00:21:19.09 9
针对业内未来的变化
-
00:21:19.09 - 00:21:20.34 8
汽车业每年都经历
-
00:21:20.41 - 00:21:20.78 2
变革
-
00:21:20.78 - 00:21:24.98 14
对这类变更进行重新验证的成本
-
00:21:24.98 - 00:21:25.72 5
往往会超过
-
00:21:25.82 - 00:21:26.85 5
10万美元
-
00:21:26.85 - 00:21:29.45 11
如果采用机械可靠性仿真
-
00:21:29.45 - 00:21:29.73 3
来取代
-
00:21:29.79 - 00:21:30.49 6
这些物理验证
-
00:21:30.49 - 00:21:33.01 13
那您将实现怎样的成本与时间
-
00:21:33.01 - 00:21:33.29 2
节约
-
00:21:36.72 - 00:21:39.35 11
我们将前面所有这些内容
-
00:21:39.41 - 00:21:42.16 9
纳入可靠性物理分析
-
00:21:42.16 - 00:21:43.94 12
涵盖机械可靠性与热可靠性
-
00:21:44.00 - 00:21:46.75 6
以及电可靠性
-
00:21:46.75 - 00:21:48.04 11
这是因为我们试图去打破
-
00:21:48.04 - 00:21:51.24 14
旧的工作流程或那一套旧的设计
-
00:21:51.24 - 00:21:51.66 7
而后构建再测试
-
00:21:51.73 - 00:21:51.95 10
并随后修复问题的方式
-
00:21:51.95 - 00:21:55.42 8
这个流程早已失效
-
00:21:55.42 - 00:21:57.19 15
今天我们已经拥有强大的仿真能力
-
00:21:57.27 - 00:22:00.74 13
这些过失的方法早就应该淘汰
-
00:22:00.74 - 00:22:00.97 2
可以
-
00:22:01.05 - 00:22:04.52 7
先仿真然后设计
-
00:22:04.52 - 00:22:05.29 4
之后构建
-
00:22:05.29 - 00:22:08.62 6
再销售并盈利
-
00:22:08.62 - 00:22:10.39 6
这就是我们的
-
00:22:10.39 - 00:22:13.27 9
可靠性物理分析优势
-
00:22:13.27 - 00:22:14.81 15
Ansys可靠性物理分析的关键
-
00:22:14.87 - 00:22:17.76 17
就在于Ansys Sherlock
-
00:22:17.76 - 00:22:18.46 4
这是一个
-
00:22:18.53 - 00:22:21.41 12
专门为电子产品设计的工具
-
00:22:21.41 - 00:22:22.63 8
可以帮助用户减少
-
00:22:22.63 - 00:22:25.52 5
几乎所有由
-
00:22:25.52 - 00:22:26.35 14
电热或机械负载引起的故障机制
-
00:22:26.41 - 00:22:29.30 2
并与
-
00:22:29.30 - 00:22:30.84 4
其他许多
-
00:22:30.90 - 00:22:33.79 7
Ansys产品
-
00:22:33.79 - 00:22:34.81 15
特别是Ansys Icepak
-
00:22:34.81 - 00:22:36.35 21
和Ansys mechanical紧密集成
-
00:22:39.68 - 00:22:42.47 23
在设计流程的早期将Ansys Sherlock
-
00:22:42.47 - 00:22:43.47 8
与其他Ansys
-
00:22:43.53 - 00:22:46.32 6
工具结合使用
-
00:22:46.32 - 00:22:46.57 1
在
-
00:22:46.64 - 00:22:49.43 8
改进整个电子设计
-
00:22:49.43 - 00:22:50.86 6
工作流程方面
-
00:22:50.86 - 00:22:53.64 7
尤其是应用方面
-
00:22:53.64 - 00:22:54.76 9
将会带来重大的机遇
-
00:22:54.82 - 00:22:57.17 14
应在正确的时间选择正确的部件
-
00:23:00.60 - 00:23:03.54 13
与Ansys的其它工具一样
-
00:23:03.54 - 00:23:04.85 4
易于量化
-
00:23:04.91 - 00:23:07.86 8
尤其是在产能方面
-
00:23:07.86 - 00:23:10.08 9
可以达到一流的产量
-
00:23:10.15 - 00:23:13.09 7
并减少产品缺陷
-
00:23:13.09 - 00:23:14.73 6
但最重要的是
-
00:23:14.73 - 00:23:18.10 10
它真正地将仿真的价值
-
00:23:18.10 - 00:23:18.33 6
与物料单成本
-
00:23:18.40 - 00:23:19.38 4
紧密相连
-
00:23:19.38 - 00:23:22.79 10
在进行第一次测试之前
-
00:23:22.79 - 00:23:23.70 9
就掌握相关成本权衡
-
00:23:23.77 - 00:23:25.22 8
并对设计进行优化
-
00:23:29.42 - 00:23:32.72 13
所有这些工具的效果都得益于
-
00:23:32.72 - 00:23:33.31 9
无可匹敌的工作流程
-
00:23:33.38 - 00:23:36.69 10
正如您在这里所看到的
-
00:23:36.69 - 00:23:37.35 11
从Sherlock开始
-
00:23:37.43 - 00:23:40.74 12
利用其同类最佳预处理能力
-
00:23:40.74 - 00:23:41.32 13
将数据输入到Icepak和
-
00:23:41.32 - 00:23:44.63 17
Ansys Mechanical中
-
00:23:44.63 - 00:23:45.88 9
这四种工具紧密协作
-
00:23:45.95 - 00:23:49.25 16
基于电气与热 机械 和物理场分析
-
00:23:49.25 - 00:23:50.36 4
为您提供
-
00:23:50.43 - 00:23:53.73 15
针对电子设备与封装及板和系统的
-
00:23:53.73 - 00:23:55.86 3
可靠性
-
00:23:55.86 - 00:23:57.62 4
深度情报
-
00:24:00.97 - 00:24:03.72 6
我认为没有比
-
00:24:03.72 - 00:24:04.15 10
电热分析更好的例子了
-
00:24:04.21 - 00:24:06.96 26
SIWave和HFSS以及Icepak之间的紧密集成
-
00:24:06.96 - 00:24:07.76 13
将数据输入到Icepak和
-
00:24:07.82 - 00:24:10.51 12
实现运行这些电仿真的能力
-
00:24:10.51 - 00:24:13.57 7
捕获这类电负载
-
00:24:13.57 - 00:24:15.20 10
为热仿真提供能量参数
-
00:24:15.26 - 00:24:18.32 6
并将其反馈到
-
00:24:18.32 - 00:24:19.13 6
材料特性中的
-
00:24:19.20 - 00:24:22.25 5
温度相依性
-
00:24:22.25 - 00:24:24.09 9
这一点简直无人能及
-
00:24:24.09 - 00:24:26.21 4
它确保了
-
00:24:26.21 - 00:24:26.92 3
电磁和
-
00:24:26.97 - 00:24:27.87 7
热仿真的高精度
-
00:24:31.87 - 00:24:35.04 12
最终所有这些工具协同工作
-
00:24:35.04 - 00:24:35.89 2
通过
-
00:24:35.96 - 00:24:38.29 2
使用
-
00:24:38.29 - 00:24:41.00 18
SI Wave与Mechanical
-
00:24:41.00 - 00:24:41.18 1
和
-
00:24:41.24 - 00:24:43.95 33
Icepak以及Ansys optiSLang来优化电子系统的性能
-
00:24:43.95 - 00:24:44.55 6
我们可以研究
-
00:24:44.61 - 00:24:47.32 10
各类参数化设计的变体
-
00:24:47.32 - 00:24:49.31 7
并确定最优配置
-
00:24:49.31 - 00:24:52.34 10
例如散热器的最优设计
-
00:24:52.34 - 00:24:52.54 5
应该怎样把
-
00:24:52.61 - 00:24:55.64 7
一块电路板装在
-
00:24:55.64 - 00:24:55.71 3
外壳上
-
00:24:55.71 - 00:24:59.18 11
您当然可以采用传统方法
-
00:24:59.18 - 00:24:59.96 10
利用对以往成功经验的
-
00:25:00.03 - 00:25:00.58 7
大致理解去设计
-
00:25:00.58 - 00:25:03.07 7
或是将设计优化
-
00:25:03.07 - 00:25:03.52 10
基于鲁棒性物理分析和
-
00:25:03.57 - 00:25:06.07 2
降阶
-
00:25:06.07 - 00:25:06.73 2
模型
-
00:25:06.79 - 00:25:08.68 11
确保自己首次即获得成功
-
00:25:14.35 - 00:25:16.81 4
大量案例
-
00:25:16.81 - 00:25:16.98 2
显示
-
00:25:17.03 - 00:25:19.50 1
将
-
00:25:19.50 - 00:25:21.26 6
综合多物理场
-
00:25:21.31 - 00:25:23.78 10
工作流程用于电热结构
-
00:25:23.78 - 00:25:25.32 5
和动态电源
-
00:25:25.32 - 00:25:26.97 5
管理业务中
-
00:25:26.97 - 00:25:27.76 11
可以获得明显的量化优势
-
00:25:32.82 - 00:25:33.79 8
如需了解有关详情
-
00:25:36.13 - 00:25:38.58 8
这里的的矩阵向您
-
00:25:38.58 - 00:25:39.18 3
展示了
-
00:25:39.23 - 00:25:41.68 8
我们在电子可靠性
-
00:25:41.68 - 00:25:42.83 16
仿真下所涵盖的全部Ansys产品
-
00:25:42.88 - 00:25:45.34 7
您可以参照自身
-
00:25:45.34 - 00:25:46.86 6
或是您的企业
-
00:25:46.86 - 00:25:49.10 7
可能遇到的问题
-
00:25:49.10 - 00:25:52.14 13
并结合自身情况选择有关产品
-
00:25:52.14 - 00:25:55.52 8
我们期待您的垂询
-
00:25:55.52 - 00:25:56.56 2
谢谢
-
00:00:00.00 - 00:00:04.03 43
Hello and welcome to you Ansys presentation
-
00:00:04.03 - 00:00:05.47 17
on best practices
-
00:00:05.56 - 00:00:08.97 38
in stimulating electronics reliability
-
00:00:12.20 - 00:00:14.81 44
Why do we care about electronics reliability
-
00:00:14.81 - 00:00:18.33 43
Because it's increasingly more difficult to
-
00:00:18.33 - 00:00:19.67 18
design electronics
-
00:00:19.67 - 00:00:23.89 45
All the major technology trends 5G autonomous
-
00:00:23.89 - 00:00:26.98 38
electrifitation industrial Internet of
-
00:00:27.08 - 00:00:30.27 34
things all demand more performance
-
00:00:30.27 - 00:00:34.07 32
smaller products and lower costs
-
00:00:34.07 - 00:00:37.66 39
The result we're seeing higher power in
-
00:00:37.66 - 00:00:39.33 26
today's electronics higher
-
00:00:39.41 - 00:00:42.29 36
speeds increasingly smaller packages
-
00:00:42.29 - 00:00:45.99 33
demands for performance at higher
-
00:00:45.99 - 00:00:46.08 12
temperatures
-
00:00:46.08 - 00:00:49.53 44
demands for performance under more strenuous
-
00:00:49.53 - 00:00:51.46 25
electromagnetic radiation
-
00:00:51.46 - 00:00:54.05 42
and the ability to do all this while still
-
00:00:54.05 - 00:00:54.56 11
maintaining
-
00:00:54.62 - 00:00:57.21 42
very high reliability over long periods of
-
00:00:57.21 - 00:00:57.33 4
time
-
00:01:00.87 - 00:01:03.47 32
We want to talk about simulation
-
00:01:03.47 - 00:01:06.68 42
Electronic reliability because we know and
-
00:01:06.68 - 00:01:09.04 35
we've demonstrated through multiple
-
00:01:09.11 - 00:01:09.97 12
case studies
-
00:01:09.97 - 00:01:13.46 39
that when we use simulation to evaluate
-
00:01:13.46 - 00:01:15.16 32
electronics reliability early in
-
00:01:15.24 - 00:01:16.64 18
the design process
-
00:01:16.64 - 00:01:20.94 42
we see enormous benefits Benefits in terms
-
00:01:20.94 - 00:01:22.19 14
of performance
-
00:01:22.19 - 00:01:25.63 40
Benefits in terms of reduction in design
-
00:01:25.63 - 00:01:25.79 6
cycles
-
00:01:25.79 - 00:01:28.51 44
Benefits in terms of reducing material costs
-
00:01:33.51 - 00:01:36.59 41
How do we do this how do we do simulation
-
00:01:36.66 - 00:01:39.45 37
electronics reliability the right way
-
00:01:39.45 - 00:01:43.83 42
The best way is through Ansys' broad range
-
00:01:43.83 - 00:01:44.13 2
of
-
00:01:44.22 - 00:01:45.79 16
simulation tools
-
00:01:45.79 - 00:01:50.34 37
That combined to provide an unrivaled
-
00:01:50.34 - 00:01:50.45 8
workflow
-
00:01:50.45 - 00:01:54.46 45
to give organizations and users worldwide the
-
00:01:54.46 - 00:01:56.69 24
ability to comprehensive
-
00:01:56.78 - 00:01:59.82 34
multi physics solution simulations
-
00:01:59.82 - 00:02:03.35 45
all the way down from the transistor level to
-
00:02:03.35 - 00:02:03.66 3
the
-
00:02:03.74 - 00:02:07.04 40
chip to the package to the PCB into full
-
00:02:07.12 - 00:02:08.69 20
and complete systems
-
00:02:08.69 - 00:02:12.28 45
And we do that by evaluating reliability from
-
00:02:12.28 - 00:02:13.40 13
an electrical
-
00:02:13.48 - 00:02:17.07 43
perspective thermal perspective mechanicles
-
00:02:17.07 - 00:02:17.87 11
perspective
-
00:02:17.87 - 00:02:20.39 39
We capture all those from a reliability
-
00:02:20.39 - 00:02:20.89 14
physics and we
-
00:02:20.95 - 00:02:23.48 39
allow all those reliability simulations
-
00:02:23.48 - 00:02:24.71 27
interact with each other to
-
00:02:24.77 - 00:02:27.29 37
provide a comprehensive multi physics
-
00:02:27.29 - 00:02:27.35 8
solution
-
00:02:31.16 - 00:02:33.41 38
And we do this in a variety of ways we
-
00:02:33.47 - 00:02:36.13 42
look at electrical reliability right there
-
00:02:36.13 - 00:02:37.31 22
are numerous number of
-
00:02:37.37 - 00:02:40.04 38
challenges when it comes to electrical
-
00:02:40.04 - 00:02:40.34 11
reliability
-
00:02:40.34 - 00:02:43.49 39
Whether it's improving power and signal
-
00:02:43.49 - 00:02:45.24 30
integrity with today's devices
-
00:02:45.31 - 00:02:48.46 40
minimizing EMI risk or improving antenna
-
00:02:48.46 - 00:02:48.95 11
performance
-
00:02:48.95 - 00:02:52.55 43
Ansys has the capabilities of solving those
-
00:02:52.55 - 00:02:53.43 10
challenges
-
00:02:53.43 - 00:02:58.26 52
through robust simulations system level ESD analysis
-
00:02:58.26 - 00:03:02.06 40
and direct current insulation resistance
-
00:03:02.06 - 00:03:03.58 22
based thermal analysis
-
00:03:03.58 - 00:03:07.83 43
The results dynamic checks on electrostatic
-
00:03:07.83 - 00:03:09.72 21
discharge sensitivity
-
00:03:09.72 - 00:03:12.81 35
connections with thermal mechanical
-
00:03:12.81 - 00:03:15.15 43
reliability solutions and possibly the most
-
00:03:15.22 - 00:03:18.31 44
important early detection mitigation of risk
-
00:03:18.31 - 00:03:19.28 14
due to EMI EMC
-
00:03:19.35 - 00:03:19.90 8
failures
-
00:03:23.74 - 00:03:27.22 37
Thermal reliability addresses its own
-
00:03:27.22 - 00:03:30.39 48
challenges whether optimizing cooling strategies
-
00:03:30.46 - 00:03:33.95 44
or addressing thermal management at multiple
-
00:03:33.95 - 00:03:35.42 19
scales from chip to
-
00:03:35.49 - 00:03:36.58 14
package to PCB
-
00:03:36.58 - 00:03:39.45 44
How does Ansys address those challenges from
-
00:03:39.45 - 00:03:40.79 21
a thermal reliability
-
00:03:40.86 - 00:03:43.73 33
perspective really with unrivaled
-
00:03:43.73 - 00:03:44.82 28
comprehensive electrothermal
-
00:03:44.82 - 00:03:48.21 46
and thermal structural multiphysics simulation
-
00:03:48.21 - 00:03:49.20 12
capabilities
-
00:03:49.20 - 00:03:52.28 45
The multiphysics capabilities offered through
-
00:03:52.28 - 00:03:54.75 36
Ansys' thermal reliability tools are
-
00:03:54.82 - 00:03:55.44 9
unrivaled
-
00:03:55.44 - 00:03:58.02 40
and which really exciting his ability to
-
00:03:58.02 - 00:03:59.05 22
provide that unrivaled
-
00:03:59.11 - 00:04:01.47 41
connection between electrical and thermal
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00:04:01.47 - 00:04:04.31 38
and then present it in a reduced order
-
00:04:04.31 - 00:04:04.44 8
modeling
-
00:04:04.44 - 00:04:06.55 44
to extract the information and present it at
-
00:04:06.55 - 00:04:07.12 12
system level
-
00:04:09.42 - 00:04:12.18 43
Great examples of outputs from this thermal
-
00:04:12.18 - 00:04:13.95 30
reliability simulation include
-
00:04:14.02 - 00:04:16.78 35
obviously temperature prediction of
-
00:04:16.78 - 00:04:18.80 42
components or really enhance and optimized
-
00:04:18.86 - 00:04:19.97 18
cooling strategies
-
00:04:19.97 - 00:04:23.19 37
Only pay for the cooling strategy you
-
00:04:23.19 - 00:04:24.05 19
absolutely need how
-
00:04:24.13 - 00:04:27.35 40
do you do that you need accurate thermal
-
00:04:27.35 - 00:04:27.86 11
simulations
-
00:04:27.86 - 00:04:29.99 45
The thermal simulations need to tell you what
-
00:04:29.99 - 00:04:30.56 11
the effects
-
00:04:30.61 - 00:04:32.74 37
are from an electrical and mechanical
-
00:04:32.74 - 00:04:33.60 25
perspective and all three
-
00:04:33.64 - 00:04:35.78 39
need to connect in terms of reliability
-
00:04:35.78 - 00:04:36.02 10
prediction
-
00:04:40.37 - 00:04:43.50 43
Ansys obviously is the world leader when it
-
00:04:43.50 - 00:04:43.98 8
comes to
-
00:04:44.05 - 00:04:47.18 38
mechanical reliability simulations and
-
00:04:47.18 - 00:04:49.13 29
that's nowhere more true than
-
00:04:49.20 - 00:04:52.33 41
electronics really Ansys is the only tool
-
00:04:52.33 - 00:04:53.09 11
provider in
-
00:04:53.09 - 00:04:56.43 44
which its mechanical reliability tools focus
-
00:04:56.43 - 00:04:59.11 36
exclusively on electronic simulation
-
00:04:59.18 - 00:05:02.52 43
electronic designs and processes to provide
-
00:05:02.52 - 00:05:03.71 17
users an easy and
-
00:05:03.78 - 00:05:07.12 48
robust methodology for evaluating the mechanical
-
00:05:07.12 - 00:05:09.13 26
reliability of electronics
-
00:05:09.13 - 00:05:12.46 44
And this is more important than ever because
-
00:05:12.46 - 00:05:13.64 16
physical testing
-
00:05:13.72 - 00:05:17.05 41
is increasingly expensive is increasingly
-
00:05:17.05 - 00:05:18.98 29
time consuming time that most
-
00:05:19.05 - 00:05:22.38 45
design teams can't afford in terms of rushing
-
00:05:22.38 - 00:05:23.05 8
in terms
-
00:05:23.05 - 00:05:27.08 34
of addressing time to market needs
-
00:05:27.08 - 00:05:30.25 41
Like I said Ansys capabilities are unique
-
00:05:30.25 - 00:05:31.03 12
in that they
-
00:05:31.10 - 00:05:34.27 45
provide very direct and specific abilities to
-
00:05:34.27 - 00:05:35.33 14
model both the
-
00:05:35.40 - 00:05:36.96 22
PCB and the components
-
00:05:36.96 - 00:05:40.32 41
and provide extremely advanced solvers to
-
00:05:40.32 - 00:05:41.67 21
address some of these
-
00:05:41.75 - 00:05:44.52 37
really complex mechanical simulations
-
00:05:44.52 - 00:05:47.59 37
The result is an extremely streamline
-
00:05:47.59 - 00:05:48.96 27
workflow that provides very
-
00:05:49.03 - 00:05:52.10 34
accurate understandings of product
-
00:05:52.10 - 00:05:53.74 34
performance under a broad range of
-
00:05:53.81 - 00:05:56.89 45
thermal mechanical mechanical conditions such
-
00:05:56.89 - 00:05:59.42 36
as temperature cycling thermal shock
-
00:05:59.42 - 00:06:01.22 18
vibration and drop
-
00:06:06.45 - 00:06:09.42 32
What we like to do here at Ansys
-
00:06:09.42 - 00:06:12.32 49
to provide value to our customers is bringing all
-
00:06:12.32 - 00:06:13.10 11
these world
-
00:06:13.16 - 00:06:16.07 36
leading tools electrical reliability
-
00:06:16.07 - 00:06:18.71 42
simulation thermal reliability simulations
-
00:06:18.78 - 00:06:21.68 45
and mechanical reliability stations bring 'em
-
00:06:21.68 - 00:06:23.30 24
all together and provide
-
00:06:23.30 - 00:06:27.32 40
our users clear insight into what it all
-
00:06:27.32 - 00:06:27.41 5
means
-
00:06:27.41 - 00:06:31.09 39
And that is the linchpin of reliability
-
00:06:31.09 - 00:06:32.00 16
physics analysis
-
00:06:32.00 - 00:06:34.79 37
When we look or we perform electrical
-
00:06:34.79 - 00:06:35.98 26
reliability simulations or
-
00:06:36.04 - 00:06:38.84 45
thermal reliability simulations or mechanical
-
00:06:38.84 - 00:06:41.45 31
reliability simulations we have
-
00:06:41.51 - 00:06:43.01 24
to ask ourselves So what
-
00:06:43.01 - 00:06:44.53 21
What does it all mean
-
00:06:44.53 - 00:06:48.51 44
By taking it the final step and doing actual
-
00:06:48.51 - 00:06:49.40 11
predictions
-
00:06:49.49 - 00:06:53.47 44
through our unique reliability physics tools
-
00:06:53.47 - 00:06:55.33 21
we connect true costs
-
00:06:55.42 - 00:06:59.41 47
planning costs design costs to savings or costs
-
00:06:59.41 - 00:06:59.85 6
out in
-
00:06:59.85 - 00:07:04.31 39
the field warranty costs so now one can
-
00:07:04.31 - 00:07:04.41 6
design
-
00:07:04.41 - 00:07:08.67 44
your product to meet your reliable goals and
-
00:07:08.67 - 00:07:09.34 7
no more
-
00:07:09.43 - 00:07:10.10 7
no less
-
00:07:15.34 - 00:07:18.16 24
And then all these tools
-
00:07:18.16 - 00:07:21.59 48
in an amazing way talk to each other communicate
-
00:07:21.59 - 00:07:22.35 9
with each
-
00:07:22.43 - 00:07:25.86 44
other are tightly integrated with each other
-
00:07:25.86 - 00:07:27.31 19
this interaction of
-
00:07:27.39 - 00:07:30.82 43
multiple physics of which the core is Ansys
-
00:07:30.82 - 00:07:31.51 6
Icepak
-
00:07:31.51 - 00:07:35.07 43
really allows customers to optimize product
-
00:07:35.07 - 00:07:37.20 28
performance and provide deep
-
00:07:37.28 - 00:07:40.83 45
insights in their products in ways never seen
-
00:07:40.83 - 00:07:41.62 10
before and
-
00:07:41.70 - 00:07:44.31 33
far earlier in the design process
-
00:07:44.31 - 00:07:48.44 39
This comprehensive multiphysics allowed
-
00:07:48.44 - 00:07:50.83 23
customers to truly push
-
00:07:50.92 - 00:07:54.14 35
design based upon robust simulation
-
00:07:54.14 - 00:07:57.72 45
As opposed to stimulating whatever the design
-
00:07:57.72 - 00:07:58.84 13
team has come
-
00:07:58.92 - 00:07:59.48 7
up with
-
00:07:59.48 - 00:08:02.38 37
And by connecting all these different
-
00:08:02.38 - 00:08:03.74 28
simulation tools together it
-
00:08:03.80 - 00:08:06.71 45
increases collaboration across the enterprise
-
00:08:12.07 - 00:08:15.70 42
Like we said when you do simulation in the
-
00:08:15.70 - 00:08:15.94 5
right
-
00:08:16.02 - 00:08:18.53 31
way the benefits are measurable
-
00:08:18.53 - 00:08:20.98 11
and amazing
-
00:08:20.98 - 00:08:24.65 44
One customer Danfoss by using Ansys Sherlock
-
00:08:24.65 - 00:08:26.61 23
the leading reliability
-
00:08:26.69 - 00:08:30.36 41
physics tool for electronics they reduced
-
00:08:30.36 - 00:08:31.66 20
their time to market
-
00:08:31.75 - 00:08:32.24 6
by 75%
-
00:08:32.24 - 00:08:34.77 14
That's amazing
-
00:08:34.77 - 00:08:38.39 45
In addition another leading chip manufacturer
-
00:08:38.39 - 00:08:40.89 30
reduced their stimulation time
-
00:08:40.97 - 00:08:42.10 14
by over 2000 X
-
00:08:42.10 - 00:08:45.41 42
and naturally critical right to really get
-
00:08:45.41 - 00:08:46.81 21
deep understanding of
-
00:08:46.88 - 00:08:49.17 31
performance of your electronics
-
00:08:49.17 - 00:08:51.77 43
One need to do simulation at multiple steps
-
00:08:51.77 - 00:08:52.06 6
in the
-
00:08:52.11 - 00:08:53.68 27
product development process
-
00:08:53.68 - 00:08:56.98 44
and provide as much detail in the simulation
-
00:08:56.98 - 00:08:57.79 11
as possible
-
00:08:57.79 - 00:09:00.62 46
Many enterprises are often hesitant to do this
-
00:09:00.62 - 00:09:01.13 7
because
-
00:09:01.19 - 00:09:04.02 44
they're concerned about the time required to
-
00:09:04.02 - 00:09:04.47 7
do this
-
00:09:04.47 - 00:09:07.85 36
By ultilizing Ansys IcePak and Ansys
-
00:09:07.85 - 00:09:10.19 32
reduced order model capabilities
-
00:09:10.19 - 00:09:13.28 38
engineers exploited this capability to
-
00:09:13.28 - 00:09:14.87 12
provide full
-
00:09:14.94 - 00:09:18.04 40
CFD simulation far faster than before it
-
00:09:18.04 - 00:09:19.34 23
really makes simulation
-
00:09:19.41 - 00:09:22.51 42
the possibility of simulation to be deeply
-
00:09:22.51 - 00:09:23.41 15
embedded in the
-
00:09:23.41 - 00:09:26.94 27
product development process
-
00:09:26.94 - 00:09:29.65 40
And finally an antenna developer reduced
-
00:09:29.65 - 00:09:30.85 23
their material costs by
-
00:09:30.91 - 00:09:31.09 3
20%
-
00:09:31.09 - 00:09:34.24 44
by optimizing the design before building any
-
00:09:34.24 - 00:09:34.95 10
prototypes
-
00:09:34.95 - 00:09:37.51 43
You can read about all the key studies here
-
00:09:37.51 - 00:09:37.57 2
in
-
00:09:37.63 - 00:09:38.60 17
this presentation
-
00:09:44.20 - 00:09:47.34 45
So we provided a broad range of resources for
-
00:09:47.34 - 00:09:47.62 3
you
-
00:09:47.69 - 00:09:50.83 43
to learn more about electronics reliability
-
00:09:50.83 - 00:09:53.14 34
including white papers application
-
00:09:53.21 - 00:09:54.82 23
briefs customer stories
-
00:09:54.82 - 00:09:58.33 45
comprehensive webinars tips and tricks in our
-
00:09:58.33 - 00:09:59.89 16
own unique Ansys
-
00:09:59.97 - 00:10:00.91 12
learning hub
-
00:10:00.91 - 00:10:04.38 41
I especially would point you to the white
-
00:10:04.38 - 00:10:04.76 8
paper on
-
00:10:04.84 - 00:10:08.31 45
SAE J3168 which describing how the automotive
-
00:10:08.31 - 00:10:09.54 15
supply chain is
-
00:10:09.62 - 00:10:13.09 41
increasingly moving towards standardizing
-
00:10:13.09 - 00:10:15.41 33
simulation not just physical test
-
00:10:15.41 - 00:10:18.82 42
as a final step in validating any products
-
00:10:18.82 - 00:10:19.35 8
going in
-
00:10:19.42 - 00:10:20.79 18
in today's vehicle
-
00:10:20.79 - 00:10:24.26 44
As time to market its kind of market reduces
-
00:10:24.26 - 00:10:24.50 6
in the
-
00:10:24.57 - 00:10:28.05 37
automotive space but complexity rises
-
00:10:28.05 - 00:10:30.14 36
astronomically with the introduction
-
00:10:30.21 - 00:10:32.46 29
of autonomous electrification
-
00:10:32.46 - 00:10:36.27 45
the need for a simulation interchange between
-
00:10:36.27 - 00:10:38.14 21
supplier and customer
-
00:10:38.22 - 00:10:40.35 25
is increasingly necessary
-
00:10:45.51 - 00:10:48.01 45
So for the rest of presentation let's just do
-
00:10:48.01 - 00:10:48.13 1
a
-
00:10:48.18 - 00:10:50.69 42
brief overview of each of the capabilities
-
00:10:50.69 - 00:10:51.30 13
and break out
-
00:10:51.36 - 00:10:53.87 38
what they're able to bring in terms of
-
00:10:53.87 - 00:10:54.37 15
simulation best
-
00:10:54.37 - 00:10:54.87 9
practices
-
00:10:58.84 - 00:11:00.82 41
When we talk about electrical reliability
-
00:11:04.04 - 00:11:06.97 46
What really makes Ansys electrical reliability
-
00:11:06.97 - 00:11:08.07 18
tools stand out is
-
00:11:08.14 - 00:11:11.07 41
their ability to do an extensive range of
-
00:11:11.07 - 00:11:12.37 23
simulation capabilities
-
00:11:12.43 - 00:11:15.36 39
to capture all types of performance and
-
00:11:15.36 - 00:11:16.41 21
potential risk issues
-
00:11:16.41 - 00:11:19.66 44
and to do that at multiple levels within the
-
00:11:19.66 - 00:11:20.17 7
product
-
00:11:20.24 - 00:11:23.50 43
specifically around our chip package system
-
00:11:23.50 - 00:11:24.16 10
capability
-
00:11:24.16 - 00:11:26.64 44
further it's power integrity and reliability
-
00:11:26.64 - 00:11:27.85 23
simulation can start at
-
00:11:27.91 - 00:11:30.39 49
the transistor level work all the way through the
-
00:11:30.39 - 00:11:30.72 6
system
-
00:11:30.78 - 00:11:31.83 17
and the abilities
-
00:11:31.83 - 00:11:34.46 25
Within the Ansys tool set
-
00:11:34.46 - 00:11:37.08 45
to do these simulations in a way that you can
-
00:11:37.14 - 00:11:39.76 43
carry there from one level to the other and
-
00:11:39.76 - 00:11:39.88 3
you
-
00:11:39.94 - 00:11:42.56 41
can also couple these chip package system
-
00:11:42.56 - 00:11:43.67 22
interactions to ensure
-
00:11:43.67 - 00:11:45.18 26
full product functionality
-
00:11:48.59 - 00:11:51.84 38
Some examples include signal integrity
-
00:11:51.84 - 00:11:51.99 8
analysis
-
00:11:51.99 - 00:11:54.57 45
Which is increasingly critical as one goes to
-
00:11:54.57 - 00:11:55.37 13
higher speeds
-
00:11:55.43 - 00:11:57.90 43
especially for the latest memory technology
-
00:12:03.01 - 00:12:05.85 44
What we described as DCIR thermal simulation
-
00:12:05.85 - 00:12:06.36 7
I think
-
00:12:06.42 - 00:12:09.26 42
this is one of the cooler workflows within
-
00:12:09.26 - 00:12:09.71 9
the Ansys
-
00:12:09.77 - 00:12:12.61 40
product family here in a tightly coupled
-
00:12:12.61 - 00:12:13.56 19
interaction one can
-
00:12:13.56 - 00:12:16.40 44
compute DC voltage and DC current density in
-
00:12:16.40 - 00:12:17.04 18
Ansys SI wave send
-
00:12:17.10 - 00:12:19.94 38
that to Ansys IcePak Ansys IcePak then
-
00:12:19.94 - 00:12:20.51 9
send that
-
00:12:20.58 - 00:12:23.42 35
information back to Ansys SIwave to
-
00:12:23.42 - 00:12:24.11 15
update material
-
00:12:24.11 - 00:12:26.99 40
properties right now especially with the
-
00:12:26.99 - 00:12:28.27 24
copper which updates the
-
00:12:28.33 - 00:12:31.21 43
current density which then results in a new
-
00:12:31.21 - 00:12:32.16 16
computation this
-
00:12:32.23 - 00:12:35.10 42
thermal aware approach provides really the
-
00:12:35.10 - 00:12:36.89 30
industry leading most accurate
-
00:12:36.89 - 00:12:39.92 37
identification of current density and
-
00:12:39.92 - 00:12:41.54 31
temperature at the chip package
-
00:12:41.61 - 00:12:44.64 42
and even board level and more recently now
-
00:12:44.64 - 00:12:45.18 16
within the Ansys
-
00:12:45.24 - 00:12:48.27 40
family one can take that information and
-
00:12:48.27 - 00:12:50.16 32
compute electromigration failure
-
00:12:50.16 - 00:12:51.37 18
rates and lifetime
-
00:12:55.53 - 00:12:58.51 41
EMI simulation probably the most critical
-
00:12:58.51 - 00:12:59.44 13
aspect of any
-
00:12:59.51 - 00:13:01.57 31
kind of electronics reliability
-
00:13:01.57 - 00:13:04.40 40
within Anysys EMI simulation is just one
-
00:13:04.40 - 00:13:04.78 9
part of a
-
00:13:04.84 - 00:13:07.68 45
three legged stool including signal integrity
-
00:13:07.68 - 00:13:09.13 22
and power integrity to
-
00:13:09.20 - 00:13:12.03 43
make sure that your device and your PCB and
-
00:13:12.03 - 00:13:12.22 4
your
-
00:13:12.22 - 00:13:15.04 35
system works under a broad range of
-
00:13:15.04 - 00:13:16.74 36
electromagnetic radiation situations
-
00:13:22.01 - 00:13:25.15 39
These simulations under the auspices of
-
00:13:25.15 - 00:13:27.17 34
electric reliability provide clear
-
00:13:27.24 - 00:13:28.71 21
quantifiable benefits
-
00:13:28.71 - 00:13:31.18 35
like all simulations but especially
-
00:13:31.18 - 00:13:32.99 43
electric reliability simulations it reduces
-
00:13:33.04 - 00:13:35.51 39
the number of board spins it's going to
-
00:13:35.51 - 00:13:36.06 15
improve product
-
00:13:36.12 - 00:13:38.59 41
reliability especially through the unique
-
00:13:38.59 - 00:13:40.84 44
capability of thermal aware electromigration
-
00:13:40.84 - 00:13:44.43 44
simulation and it really guides designers in
-
00:13:44.43 - 00:13:45.95 19
the earliest stages
-
00:13:46.03 - 00:13:49.62 42
possible on how to improve EMI EMC and ESD
-
00:13:49.62 - 00:13:49.78 4
risk
-
00:13:49.86 - 00:13:53.45 42
mitigation are both device package and PCB
-
00:13:53.45 - 00:13:53.69 5
level
-
00:13:59.18 - 00:14:00.80 25
Under thermal reliability
-
00:14:03.09 - 00:14:05.70 36
Ansys provides what you need because
-
00:14:05.70 - 00:14:07.09 29
really there's really nothing
-
00:14:07.15 - 00:14:09.76 44
more important than thermal reliability when
-
00:14:09.76 - 00:14:11.10 23
it comes to electronics
-
00:14:11.16 - 00:14:13.77 43
almost every kind of performance or failure
-
00:14:13.77 - 00:14:14.99 22
mechanisms that drives
-
00:14:14.99 - 00:14:18.10 43
electronic reliability in some way shape or
-
00:14:18.10 - 00:14:19.34 21
form is influenced by
-
00:14:19.41 - 00:14:20.17 11
temperature
-
00:14:20.17 - 00:14:23.11 43
So the accuracy of knowing that temperature
-
00:14:23.11 - 00:14:25.70 38
in your electronics and controlling it
-
00:14:25.70 - 00:14:26.74 24
effectively is paramount
-
00:14:30.19 - 00:14:33.05 41
Ansys does this more effectively than any
-
00:14:33.05 - 00:14:33.75 14
other tool set
-
00:14:33.82 - 00:14:36.68 40
in the market because it can offer it at
-
00:14:36.68 - 00:14:36.75 5
every
-
00:14:36.81 - 00:14:39.49 42
single scale within the overall electronic
-
00:14:39.49 - 00:14:44.21 45
system from transistor and chip to package to
-
00:14:44.21 - 00:14:45.26 9
board and
-
00:14:45.37 - 00:14:46.21 8
assembly
-
00:14:46.21 - 00:14:49.70 43
to box level and finally the full system or
-
00:14:49.70 - 00:14:50.01 4
even
-
00:14:50.09 - 00:14:53.58 37
data center level and by using Ansys'
-
00:14:53.58 - 00:14:54.82 20
unique reduced order
-
00:14:54.90 - 00:14:55.37 6
models
-
00:14:55.37 - 00:14:59.49 42
physics based behavior can be carried from
-
00:14:59.49 - 00:15:00.41 12
one level to
-
00:15:00.50 - 00:15:04.62 42
the next in a way that's portable fast and
-
00:15:04.62 - 00:15:05.27 9
effective
-
00:15:08.51 - 00:15:11.76 43
Some examples of how thermal reliability is
-
00:15:11.76 - 00:15:12.78 15
done within the
-
00:15:12.85 - 00:15:16.11 39
Ansys tool set just some examples right
-
00:15:16.11 - 00:15:16.76 11
here one is
-
00:15:16.84 - 00:15:20.09 45
our unique ability to PCB thermal reliability
-
00:15:20.09 - 00:15:21.25 15
we provide very
-
00:15:21.25 - 00:15:24.51 45
high fidelity PC modeling capabilities unique
-
00:15:24.51 - 00:15:26.25 23
in the industry there's
-
00:15:26.32 - 00:15:29.58 44
a broad range of how one can capture thermal
-
00:15:29.58 - 00:15:30.30 10
conduction
-
00:15:30.38 - 00:15:33.64 44
and convection behavior at the PCB level are
-
00:15:33.64 - 00:15:34.94 18
unique orthotropic
-
00:15:34.94 - 00:15:37.96 44
connectivity map can capture trace via plane
-
00:15:37.96 - 00:15:38.84 13
and pad layer
-
00:15:38.90 - 00:15:41.93 41
pad data for each layer and very actually
-
00:15:41.93 - 00:15:42.60 13
capture these
-
00:15:42.67 - 00:15:45.69 37
thermal pathways to get very accurate
-
00:15:45.69 - 00:15:47.44 33
temperature predictions for every
-
00:15:47.44 - 00:15:49.00 24
single device on the PCB
-
00:15:54.42 - 00:15:56.99 46
Thermal reliability that is really the core or
-
00:15:56.99 - 00:15:57.22 3
the
-
00:15:57.28 - 00:15:59.86 41
crux of a lot of our reliability concerns
-
00:15:59.86 - 00:16:00.09 7
when it
-
00:16:00.14 - 00:16:02.72 45
comes to electronics and Ansys realizing that
-
00:16:02.72 - 00:16:03.75 18
makes Ansys IcePak
-
00:16:03.75 - 00:16:06.57 40
really the core of the foundation of our
-
00:16:06.57 - 00:16:06.95 5
multi
-
00:16:07.01 - 00:16:09.83 34
physics interaction within all our
-
00:16:09.83 - 00:16:11.02 29
electronics reliability tools
-
00:16:11.02 - 00:16:13.71 38
Whether it's at Ansys Maxwell or Ansys
-
00:16:13.71 - 00:16:14.31 12
SIwave Ansys
-
00:16:14.37 - 00:16:17.06 41
Redhawk or Ansys Sherlock IcePak talks to
-
00:16:17.06 - 00:16:17.60 11
all of them
-
00:16:17.66 - 00:16:20.35 45
in creating the robust workflows that ensures
-
00:16:20.35 - 00:16:21.31 15
that you've not
-
00:16:21.31 - 00:16:23.99 44
overlooked anything in regards to electronic
-
00:16:23.99 - 00:16:25.83 31
reliability for your electronic
-
00:16:25.89 - 00:16:26.25 6
system
-
00:16:31.58 - 00:16:34.32 44
And all these approaches in terms of thermal
-
00:16:34.32 - 00:16:35.36 17
reliability again
-
00:16:35.42 - 00:16:38.16 40
just like electrical reliability provide
-
00:16:38.16 - 00:16:39.57 27
clear quantifiable benefits
-
00:16:39.57 - 00:16:42.74 40
Thermal reliability starts with accurate
-
00:16:42.74 - 00:16:44.92 34
thermal models Ansys Icepak unlike
-
00:16:44.99 - 00:16:48.16 22
any other tool imports
-
00:16:48.16 - 00:16:48.59 6
a wide
-
00:16:48.66 - 00:16:51.48 29
array of formats for ECAD and
-
00:16:51.48 - 00:16:55.63 40
MCAD and push it out into very efficient
-
00:16:55.63 - 00:16:56.65 13
and effective
-
00:16:56.74 - 00:16:58.04 14
model creation
-
00:16:58.04 - 00:17:01.38 41
So you can decide the level of detail you
-
00:17:01.38 - 00:17:01.45 4
need
-
00:17:01.53 - 00:17:04.87 45
within your thermal model and control that in
-
00:17:04.87 - 00:17:05.99 14
ways unrivaled
-
00:17:06.06 - 00:17:07.33 17
by any other tool
-
00:17:07.33 - 00:17:10.14 41
You could do that analysis like I said at
-
00:17:10.21 - 00:17:12.07 29
every level of the electronic
-
00:17:12.07 - 00:17:15.12 41
ecosystem and the unique coupling between
-
00:17:15.12 - 00:17:16.34 20
Ansys Icepak and the
-
00:17:16.41 - 00:17:19.46 45
other Ansys tools especially Ansys Mechanical
-
00:17:19.46 - 00:17:21.84 35
and Ansys Sherlock allows engineers
-
00:17:21.90 - 00:17:24.96 40
to truly understand how to optimize that
-
00:17:24.96 - 00:17:25.64 14
thermal design
-
00:17:25.64 - 00:17:29.16 37
If you want thermal analysis you in a
-
00:17:29.16 - 00:17:29.79 15
standalone tool
-
00:17:29.79 - 00:17:31.42 27
all you know is temperature
-
00:17:34.24 - 00:17:36.73 42
Which is one thing but doesn't really tell
-
00:17:36.73 - 00:17:37.06 8
you what
-
00:17:37.12 - 00:17:39.61 43
it means in terms of reliability and at the
-
00:17:39.61 - 00:17:39.89 14
end of the day
-
00:17:39.94 - 00:17:42.43 37
that's why you're trying to determine
-
00:17:42.43 - 00:17:43.82 32
temperature otherwise just using
-
00:17:43.82 - 00:17:47.00 40
kind of old fashion and outdated thermal
-
00:17:47.00 - 00:17:48.13 20
derating tables that
-
00:17:48.20 - 00:17:51.38 33
provide little to no value to the
-
00:17:51.38 - 00:17:51.46 12
organization
-
00:17:51.46 - 00:17:54.45 37
By coupling with Ansys Mechanical and
-
00:17:54.45 - 00:17:55.78 20
Ansys Sherlock Ansys
-
00:17:55.84 - 00:17:57.71 30
Icepak really closes that loop
-
00:17:57.71 - 00:18:01.14 44
If that heat sink is cheaper than other heat
-
00:18:01.14 - 00:18:01.45 4
sink
-
00:18:01.45 - 00:18:05.22 43
You can compare the price savings on making
-
00:18:05.22 - 00:18:06.05 11
that switch
-
00:18:06.14 - 00:18:09.91 36
or the price increase to changes and
-
00:18:09.91 - 00:18:11.42 26
potential warranty returns
-
00:18:11.42 - 00:18:13.72 34
which is an analysis not available
-
00:18:13.72 - 00:18:15.05 24
among any other workflow
-
00:18:20.09 - 00:18:23.59 42
For mechanical reliability Ansys is openly
-
00:18:23.59 - 00:18:24.45 12
aware of the
-
00:18:24.53 - 00:18:28.04 37
deep simulation challenges mechanical
-
00:18:28.04 - 00:18:30.85 39
analysts have in simulating electronics
-
00:18:30.85 - 00:18:33.54 44
Most electronics nowadays especially for the
-
00:18:33.54 - 00:18:35.34 30
leading technology trends have
-
00:18:35.40 - 00:18:38.10 44
an amazingly large number of components with
-
00:18:38.10 - 00:18:39.42 22
very complex geometric
-
00:18:39.48 - 00:18:39.90 7
details
-
00:18:39.90 - 00:18:44.00 40
very complex PCBs with many features and
-
00:18:44.00 - 00:18:46.28 28
numerous materials including
-
00:18:46.37 - 00:18:48.93 28
metals ceramics and polymers
-
00:18:48.93 - 00:18:51.98 44
Ansys provides truly best in class solutions
-
00:18:51.98 - 00:18:53.40 21
by taking information
-
00:18:53.47 - 00:18:56.52 41
from the CAD integrating it with embedded
-
00:18:56.52 - 00:18:57.88 23
libraries and automated
-
00:18:57.94 - 00:19:01.00 43
workflows to provide you the user amazingly
-
00:19:01.00 - 00:19:02.15 18
quick and accurate
-
00:19:02.15 - 00:19:05.84 41
models of those ECADs that are ready from
-
00:19:05.84 - 00:19:06.25 5
stage
-
00:19:06.33 - 00:19:08.72 29
one that are simulation ready
-
00:19:08.72 - 00:19:11.75 34
Even for the most complex physical
-
00:19:11.75 - 00:19:12.56 11
simulations
-
00:19:15.99 - 00:19:19.41 44
How do we do this just some examples best in
-
00:19:19.49 - 00:19:22.99 44
class PCB modeling using Ansys Sherlocki and
-
00:19:22.99 - 00:19:25.02 25
Ansys Mechanical you have
-
00:19:25.09 - 00:19:26.11 13
a broad range
-
00:19:26.11 - 00:19:29.15 44
in terms of how you wish to address your PCB
-
00:19:29.22 - 00:19:32.33 44
in your simulation model whether you want to
-
00:19:32.33 - 00:19:33.02 10
use lumped
-
00:19:33.09 - 00:19:36.20 44
models that capture material properties over
-
00:19:36.20 - 00:19:37.31 16
the entire board
-
00:19:37.31 - 00:19:41.77 40
trace mapping which uses an overlay mesh
-
00:19:41.77 - 00:19:44.78 45
new reinforcement capability which allows you
-
00:19:44.78 - 00:19:45.92 16
to model the all
-
00:19:45.99 - 00:19:49.00 40
the traces and vias within a PCB or even
-
00:19:49.00 - 00:19:49.07 5
trace
-
00:19:49.13 - 00:19:52.15 45
modeling which models all the traces and vias
-
00:19:52.15 - 00:19:52.28 2
in
-
00:19:52.28 - 00:19:55.97 40
a 3D structure especially for relatively
-
00:19:55.97 - 00:19:56.55 11
small areas
-
00:19:56.55 - 00:19:59.21 34
Each of these provide improvements
-
00:19:59.21 - 00:20:00.10 12
or tradeoffs
-
00:20:00.16 - 00:20:02.82 45
in terms of speed and accuracy but only under
-
00:20:02.82 - 00:20:03.18 5
Ansys
-
00:20:03.24 - 00:20:05.90 42
you have all those capabilities within one
-
00:20:05.90 - 00:20:06.26 8
tool set
-
00:20:11.92 - 00:20:14.99 44
Once you have the geometry material properly
-
00:20:14.99 - 00:20:16.09 18
setup which occurs
-
00:20:16.16 - 00:20:19.23 41
almost seamlessly within Ansys you have a
-
00:20:19.23 - 00:20:19.99 14
broad range of
-
00:20:20.06 - 00:20:23.13 44
simulations one could do to evaluate a range
-
00:20:23.13 - 00:20:23.89 11
of possible
-
00:20:23.89 - 00:20:26.96 38
risks in terms electronics reliability
-
00:20:26.96 - 00:20:28.33 26
whether it's hot or reflow
-
00:20:28.40 - 00:20:31.48 38
and warpage moisture effects shock and
-
00:20:31.48 - 00:20:32.57 22
vibration or even drop
-
00:20:32.64 - 00:20:35.72 41
and tumbling all these static and dynamic
-
00:20:35.72 - 00:20:36.95 16
behaviors can be
-
00:20:36.95 - 00:20:40.01 36
captured accurately within the Ansys
-
00:20:40.01 - 00:20:41.44 29
Mechanical reliability family
-
00:20:45.65 - 00:20:48.92 45
And just like thermo electrical these feature
-
00:20:48.92 - 00:20:50.89 26
deliver clear quantifiable
-
00:20:50.96 - 00:20:51.55 8
benefits
-
00:20:51.55 - 00:20:54.03 42
How would you like to know way up front in
-
00:20:54.09 - 00:20:56.74 42
the design if there's any risk in terms of
-
00:20:56.74 - 00:20:56.80 3
any
-
00:20:56.86 - 00:20:59.52 41
environment your product might see from a
-
00:20:59.52 - 00:21:00.88 26
mechanical perspective and
-
00:21:00.88 - 00:21:04.37 37
avoid that issue way up front even at
-
00:21:04.37 - 00:21:05.30 19
component selection
-
00:21:05.30 - 00:21:08.19 43
Right and then how would you like to reduce
-
00:21:08.19 - 00:21:08.32 3
the
-
00:21:08.39 - 00:21:11.28 43
amount of physical testing you're currently
-
00:21:11.28 - 00:21:12.38 18
required to do not
-
00:21:12.44 - 00:21:15.34 45
just for initial launch but also to deal with
-
00:21:15.34 - 00:21:15.79 6
future
-
00:21:15.79 - 00:21:19.09 42
changes in the automotive industry changes
-
00:21:19.09 - 00:21:20.34 18
are done on annual
-
00:21:20.41 - 00:21:20.78 5
basis
-
00:21:20.78 - 00:21:24.98 44
And the cost to revalidate those changes can
-
00:21:24.98 - 00:21:25.72 8
be north
-
00:21:25.82 - 00:21:26.85 11
of $100,000
-
00:21:26.85 - 00:21:29.45 44
Think about the cost and time savings if you
-
00:21:29.45 - 00:21:29.73 5
could
-
00:21:29.79 - 00:21:30.49 12
replace that
-
00:21:30.49 - 00:21:33.01 27
with mechanical reliability
-
00:21:33.01 - 00:21:33.29 10
simulation
-
00:21:36.72 - 00:21:39.35 43
We take all those as we talked about and we
-
00:21:39.41 - 00:21:42.16 39
bring them into reliability physics and
-
00:21:42.16 - 00:21:43.94 34
mechanical reliability the thermal
-
00:21:44.00 - 00:21:46.75 48
reliability and electric reliability why because
-
00:21:46.75 - 00:21:48.04 21
we're trying to break
-
00:21:48.04 - 00:21:51.24 40
the old workflow right or the old design
-
00:21:51.24 - 00:21:51.66 10
build test
-
00:21:51.73 - 00:21:51.95 3
fix
-
00:21:51.95 - 00:21:55.42 44
This process doesn't work Right and with the
-
00:21:55.42 - 00:21:57.19 23
simulation capabilities
-
00:21:57.27 - 00:22:00.74 44
we have today really should never be done in
-
00:22:00.74 - 00:22:00.97 3
the
-
00:22:01.05 - 00:22:04.52 47
first place one should simulate then design and
-
00:22:04.52 - 00:22:05.29 10
then build
-
00:22:05.29 - 00:22:08.62 33
and then sell and then make money
-
00:22:08.62 - 00:22:10.39 21
Can we do this to our
-
00:22:10.39 - 00:22:13.27 42
reliability for with this capabilities the
-
00:22:13.27 - 00:22:14.81 31
linchpin of the reliability for
-
00:22:14.87 - 00:22:17.76 44
this workflow within Ansys is Ansys Sherlock
-
00:22:17.76 - 00:22:18.46 11
it's a tool
-
00:22:18.53 - 00:22:21.41 46
we use is specifically for electronics to help
-
00:22:21.41 - 00:22:22.63 20
user really mitigate
-
00:22:22.63 - 00:22:25.52 41
almost any kind of failure mechanism that
-
00:22:25.52 - 00:22:26.35 16
could occur from
-
00:22:26.41 - 00:22:29.30 42
electrical thermal or mechanical loads and
-
00:22:29.30 - 00:22:30.84 26
works in tight integration
-
00:22:30.90 - 00:22:33.79 37
with a number of other ansys products
-
00:22:33.79 - 00:22:34.81 23
especially Ansys IcePak
-
00:22:34.81 - 00:22:36.35 20
and Ansys Mechanical
-
00:22:39.68 - 00:22:42.47 43
By using Ansys Sherlock in combination with
-
00:22:42.47 - 00:22:43.47 17
these other Ansys
-
00:22:43.53 - 00:22:46.32 33
tools early in the design process
-
00:22:46.32 - 00:22:46.57 8
opens up
-
00:22:46.64 - 00:22:49.43 42
huge opportunity in terms of improving the
-
00:22:49.43 - 00:22:50.86 25
overall electronic design
-
00:22:50.86 - 00:22:53.64 40
workflow especially using it as early as
-
00:22:53.64 - 00:22:54.76 22
initial part selection
-
00:22:54.82 - 00:22:57.17 38
pick the right parts at the right time
-
00:23:00.60 - 00:23:03.54 43
Just like the other tools it provides clear
-
00:23:03.54 - 00:23:04.85 21
quantifiable benefits
-
00:23:04.91 - 00:23:07.86 34
especially the manufacture ability
-
00:23:07.86 - 00:23:10.08 36
capabilities can improve first class
-
00:23:10.15 - 00:23:13.09 43
yields and reduce manufacturing defects but
-
00:23:13.09 - 00:23:14.73 26
most importantly it really
-
00:23:14.73 - 00:23:18.10 45
ties the value of simulation back to the bill
-
00:23:18.10 - 00:23:18.33 2
of
-
00:23:18.40 - 00:23:19.38 13
material cost
-
00:23:19.38 - 00:23:22.79 40
knowing those tradeoffs and optimize the
-
00:23:22.79 - 00:23:23.70 17
design before you
-
00:23:23.77 - 00:23:25.22 21
ever go to first test
-
00:23:29.42 - 00:23:32.72 42
And all this works because of an unrivaled
-
00:23:32.72 - 00:23:33.31 11
workflow as
-
00:23:33.38 - 00:23:36.69 42
you can see here starting with Sherlock to
-
00:23:36.69 - 00:23:37.35 11
utilize its
-
00:23:37.43 - 00:23:40.74 40
best in class preprocessing to feed into
-
00:23:40.74 - 00:23:41.32 10
Icepak and
-
00:23:41.32 - 00:23:44.63 45
Ansys mechanical all four of these tools work
-
00:23:44.63 - 00:23:45.88 16
closely together
-
00:23:45.95 - 00:23:49.25 45
to provide you unrivalled insight in terms of
-
00:23:49.25 - 00:23:50.36 14
the electrical
-
00:23:50.43 - 00:23:53.73 36
thermal mechanical and physics based
-
00:23:53.73 - 00:23:55.86 37
reliability of your electronic device
-
00:23:55.86 - 00:23:57.62 24
package board and system
-
00:24:00.97 - 00:24:03.72 33
I said no better example then the
-
00:24:03.72 - 00:24:04.15 15
electro thermal
-
00:24:04.21 - 00:24:06.96 45
analysis tight integration between SIwave and
-
00:24:06.96 - 00:24:07.76 10
Icepak and
-
00:24:07.82 - 00:24:10.51 38
HFSs and Icepak the ability to kind of
-
00:24:10.51 - 00:24:13.57 46
run those electrical simulations capture those
-
00:24:13.57 - 00:24:15.20 26
electrical loads feed them
-
00:24:15.26 - 00:24:18.32 45
for thermal simulations and feed that back to
-
00:24:18.32 - 00:24:19.13 11
account for
-
00:24:19.20 - 00:24:22.25 45
temperature dependency in material properties
-
00:24:22.25 - 00:24:24.09 26
is unrivaled anywhere else
-
00:24:24.09 - 00:24:26.21 48
It ensures a high level of accuracy for both the
-
00:24:26.21 - 00:24:26.92 19
electromagnetic and
-
00:24:26.97 - 00:24:27.87 19
thermal simulations
-
00:24:31.87 - 00:24:35.04 44
And finally all these tools work together to
-
00:24:35.04 - 00:24:35.89 12
optimize the
-
00:24:35.96 - 00:24:38.29 33
performance of electronic systems
-
00:24:38.29 - 00:24:41.00 49
through using not just the SI wave and mechanical
-
00:24:41.00 - 00:24:41.18 3
and
-
00:24:41.24 - 00:24:43.95 39
Icepak but also Ansys optiSLang one can
-
00:24:43.95 - 00:24:44.55 11
investigate
-
00:24:44.61 - 00:24:47.32 45
a variety of parametric design variations and
-
00:24:47.32 - 00:24:49.31 32
determine optimal configurations
-
00:24:49.31 - 00:24:52.34 44
what is the optimal design of your heat sink
-
00:24:52.34 - 00:24:52.54 3
how
-
00:24:52.61 - 00:24:55.64 36
should you attach that board to your
-
00:24:55.64 - 00:24:55.71 9
enclosure
-
00:24:55.71 - 00:24:59.18 43
You can base it on some rough understanding
-
00:24:59.18 - 00:24:59.96 11
of previous
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00:25:00.03 - 00:25:00.58 7
success
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00:25:00.58 - 00:25:03.07 43
Or you can make sure that you're successful
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00:25:03.07 - 00:25:03.52 9
the first
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00:25:03.57 - 00:25:06.07 43
time up based on robust physic analysis and
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00:25:06.07 - 00:25:06.73 13
reduced order
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00:25:06.79 - 00:25:08.68 34
models through design optimization
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00:25:14.35 - 00:25:16.81 43
There are a number of examples that we have
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00:25:16.81 - 00:25:16.98 4
that
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00:25:17.03 - 00:25:19.50 44
shows clear quantifiable benefits when using
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00:25:19.50 - 00:25:21.26 32
this comprehensive multi physics
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00:25:21.31 - 00:25:23.78 44
workflow for both electrical thermal thermal
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00:25:23.78 - 00:25:25.32 28
structural and dynamic power
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00:25:25.32 - 00:25:26.97 10
management
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00:25:26.97 - 00:25:27.76 6
issues
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00:25:32.82 - 00:25:33.79 18
Want to learn more
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00:25:36.13 - 00:25:38.58 40
This matrix here shows you all the Ansys
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00:25:38.58 - 00:25:39.18 13
products that
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00:25:39.23 - 00:25:41.68 39
we covered under electronic reliability
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00:25:41.68 - 00:25:42.83 28
simulation and allows you to
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00:25:42.88 - 00:25:45.34 42
correlate those products to the capability
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00:25:45.34 - 00:25:46.86 30
and specific applications that
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00:25:46.86 - 00:25:49.10 27
solve the problems that you
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00:25:49.10 - 00:25:52.14 42
or your organization might be experiencing
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00:25:52.14 - 00:25:55.52 41
We're looking forward to hearing from you
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00:25:55.52 - 00:25:56.56 6
Thanks